Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
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Features & Benefits
- Labeling Claims
- CASE Ingredients Features
- Ready-to-Use Product Features
- Product Info
BONDiT B-755 exhibits superior thermal resistance compared to most epoxy systems, particularly those offering ambient curing temperature. DMA testing
demonstrate stability to 600°F. Excellent for fuel cell applications. Apply B-755 by static mixer, brush or roller. B-755 is very easy to use with low HAZMAT impact as a 100% solids epoxy system–no solvents or VOC problems.
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Adhesive & Sealant Type
- Curing Guide
Ambient cure (10 gram mix): 60 minute pot life; 90 minute gel time, 2 hours set time, 7 hours to 85% cure, dust free and may be roughly handled. Thin film ambient set time of 90 minutes and cure of 5 hours. Thermal cure at 135degF is approximately 10 minute. In 100gr quantity B-755 is exothermic which will shorten pot life. Mix part A with part B, 4:1 ratio by volume or 100/23.1 by weight. Thoroughly hand mix at least 4 minutes, or use static mixer. Degass is recommended. Optional surface prep will improve adhesion by abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe.
The usable shelf life of unopened containers of BONDiTTM B-755 resin is one year, and should be stored in cool, dry place. When not in use, containers should be kept tightly closed. Not UV sensitive; keep away from excess heat.- Coating & Potting
A unique fast set, low viscosity, ambient cure, water- white, scratch resistant UV resistant epoxy for clear-coatings of many surfaces, conformal coat of electronics, electrical component encapsulation and potting with excellent ambient cure properties.
- High Performance
High temperature to 600 °F, excellent chemical resistance, high strength even with ambient cure. rugged semi-rigid system. The product is also available in the filled (thixotropic). Bonds to many substrates such as GRE circuit boards and FKM elastomer
- Easy Use
Two-part, primerless, ambient cure system with low HAZMAT impact for work environment. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums.
- Harsh Environments
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Marine,Civil Engineering, Industrial, Downhole oil, Underwater, Mining, Industrial,, Automotive.
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Packaging & Availability
- Packaging Type
Storage & Handling
- Storage
BONDiTTM B-755 is available in side-by-side handheld and pneumatic actuated gun cartridges, quarts, gallons, pails and drums. Custom packaging, such as premixed and degassed frozen cartridges, is also available