Products

BONDiT™ B-482 is a two-part, state-of-the-art 100% solids, room-temperature curing flexible epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ B-45 is a two-part, state-of-the-art 100% resins, room-temperature curing flexible epoxy system. Especially designed for protective coating and electrical / electronic potting applications with bonding to engineering plastics, elastomers, and mineral substrates. Bondable plastics include the polyolefins--UHMW, HDPE, and PP, PET (Ertylite & Mylar), PEEK, PPS, PBT (Valox) Acetal (Delrin), ETFE, PVC, PVCF, PVDF (Kynar), ABS, ECTFE (Halar), polyamide and polyimide (Ultem & Torlon), polyimid (Vespel), fiberglass and composites. Elastomers include EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel). The B-45 bonds well to metals, glass, ceramic, cement, wood and cellulose substrates.

BONDiT™ B-4811 is a two-part, state-of-the-art 100% solids, room temperature curing rigid epoxy resin system, especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.