Products

BONDiT™ C-52 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-52 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is especially useful as a primer and adhesion promoter for injection molding to metal and glass with polyethylene, polypropylene and polyolefins in general, PPS, PVC, PBT, ABS, polysulfone, polystyrene, polyamide (nylon 6 and 66), polyamide-imide, polyimide, polyvinylbutyral, melamine, polycarbonate, polyester, polyether, phenolic, and epoxy, with molding temperatures up to 328°C/622°F.

BONDiT™ C-6 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-6 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is used as a primer coat for other BONDiT™ coatings and encapsulants.

Sealitt™ A-46 is a high performance, high and low temperature one-part thin coat sealant and architectural clear coat for metals such as copper, stainless steel, aluminum, glass, ceramics, composites and plastics. A typical single coating of 0.002” (5mm) thick provides excellent corrosion protection, with a pinhole free coating in a single 0.002” thick application. Cop- per test plates, after 6 months exposure to heavy winter rains showed no signs of corrosion or loss of architectural quality and no degredation from sun exposure.

BONDiT™ A-3 is a high performance, high temperature moisture resistant, primer, adhesive, adhesion promoter and additive used with metals, glass & ceramics, elastomers and polymers. BONDiT™ A-3 offers a wide range of capabilities for moisture resistance chemical bonding betweenminerals and polymers, as well as dissimilar polymers. it is used as a primer coat and additive for other BONDiT™ coatings and encapsulants. BONDiT™ A-3 may be used as an additive to other coatings, fiber fills, and adhesives to promote superior improvement in performance in harshenvironments.

BONDiT™ B-482 is a two-part, state-of-the-art 100% solids, room-temperature curing flexible epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ A-43 is a high performance, high and low temperature one-part primer, adhesive, adhesion promoter for metals, glass & ceramics, elastomers and polymers. BONDiT™ A-43 offers a wide range of capabilities for promoting single coat chemical bonding between minerals and polymers, as well as dissimilar polymers. it is used as a primer coat for other BONDiT™ coatings and encapsulants.

BONDiT™ A-37 is a high performance, high temperature moisture resistant, primer, adhesive, adhesion promoter and additive used with metals, glass & ceramics, elastomers and polymers. BONDiT™ A-37 offers a wide range of capabilities for promoting moisture resistance chemical bonding between minerals and polymers, as well as dissimilar polymers. it is used as a primer coat and additive for other BONDiT™ coatings and encapsulants. BONDiT™ In particular A-37 may be used as a primer to promote adhesion to silicone rubber and for vulcanizing silicone rubber to many substrates.

BONDiT™ B-4811 is a two-part, state-of-the-art 100% solids, room temperature curing rigid epoxy resin system, especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ B-45 is a two-part, state-of-the-art 100% resins, room-temperature curing flexible epoxy system. Especially designed for protective coating and electrical / electronic potting applications with bonding to engineering plastics, elastomers, and mineral substrates. Bondable plastics include the polyolefins--UHMW, HDPE, and PP, PET (Ertylite & Mylar), PEEK, PPS, PBT (Valox) Acetal (Delrin), ETFE, PVC, PVCF, PVDF (Kynar), ABS, ECTFE (Halar), polyamide and polyimide (Ultem & Torlon), polyimid (Vespel), fiberglass and composites. Elastomers include EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel). The B-45 bonds well to metals, glass, ceramic, cement, wood and cellulose substrates.

BONDiT™ B-481 is a two-part, state-of-the-art 100% solids, room-temperature curing semi-rigid epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, structural bonding metals, plastics and elastomers to various substrates with high tensile, shear and peel strength.