Products

Oxy-Bond™ 1105 Two-Component Epoxy Adhesive has high performance, medium viscosity, 5 minute fixture adhesive.

Oxy-Bond™ 159-R Thermally Conductive Epoxy Adhesivehas high temperature resistant, low viscosity, thermally conductive epoxy.

Oxy-Bond™ 109-DP Two-Component Epoxy Adhesive is transparent, low viscosity, room temperature curing adhesive.

Oxy-Bond™ 160-EX Two-Component Epoxy Adhesive has high performance, toughened, general purpose adhesive.

Resin Technology Group CT-988 Cationic UV Cure Epoxy Adhesive is an epoxy-based, paste-viscosity, cationic-curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resistant, low out-gassing polymer system capable of surviving exposure up to 150°C.

Oxy-Bond™ 1114 Two-Component Epoxy Adhesive has high shock and impact resistance for low stress applications of dissimilar materials.

Oxy-Bond™ 1161 Two-Component Epoxy Adhesive is sag resistant metal bonding adhesive.

Oxy-Bond™ 119-EX Two-Component Epoxy Adhesive has medium viscosity, flexible polyamide adhesive.

Oxy-Bond™ 1217 Two-Component Epoxy Adhesive used for Military / Aerospace grade for high impact with low stress bonding.

Oxy-Bond™ 157-F Thermally Conductive Epoxy Adhesive is used for room temperature curing, rigid, thermally conductive epoxy.

Resin Technology Group DP031199-1 Cationic UV Cure Epoxy Adhesive is an epoxy-based, low-viscosity, cationic-curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a strong, chemically resistant, low out-gassing polymer system. This UV curable adhesive is soft and flexible and cures tack free.

Resin Technology Group EN 239-2 Cationic UV Cure Epoxy Adhesive is an epoxy-based, medium viscosity, cationic- curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resistant, low out-gassing polymer system capable of surviving exposure up to 200°C.