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ResinLab® EP1026HP Part A

1 of 20 products in this brand
ResinLab® EP1026HP Part A is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product will have good resistance to water, salt spray, inorganic acids and bases and most organic solvents.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Ceramic, Metal, Plastics

Cure Method: Air Dry

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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
Instructions
  • Bring both components to room temperature prior to mixing.
  • Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Mix Ratio (By Weight)1:1--
Mix Ratio (By Volume)1.04:1--
Cure Schedule (at 100°C)1.0h-
Viscosity (Part A RVT, #5 at 5rpm)8000.0cps-
Viscosity (Part B)15000.0cps-
Viscosity (Mixed)12500.0cps-
Specific Gravity (Part A)1.13--
Specific Gravity (Part B)1.18--
Specific Gravity (Mixed)1.15--
Pot Life3.0 - 5.0min/20g mass-
Glass Transition Temperature (Tg)30.0°CDSC
Hardness80.0Shore DASTM D2240
Water Absorption (after 24 hours)1.47%ASTM D570
Tensile Strength (black says 2500)3500.0psiASTM D638
Tensile Elongation (same as BK)20-30%ASTM D638
Tensile Modulus (same as BK)200000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)3500.0psiASTM D1002
Compressive Yield Strength (add yield to black version)4300.0psiASTM D695
Compressive Strength (black says >28000)27500.0psiASTM D695
Compressive Modulus (same as BK)200000.0psiASTM D695
T-Peel Strength15.0pli-
Thermal Conductivity (by LFA)max. 0.2W/mKASTM E1461
Volume Resistivity8 x 1014Ω·cmASTM D257
Coefficient of Thermal Expansion (by TMA, 5°C/min, below Tg)55.0ppm/°CASTM E831
Dielectric Constant (25°C,100Hz)4.5-ASTM D150
Dielectric Strength440.0V/milASTM D149 Method A
Temperature Range-40 to 130°C-

Storage & Handling

Shelf Life And Storage
  • 12 months at 25°C
  • Specialty packaging may be less.
  • Store cartridges vertically to allow air to accumulate at the tip.

Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50°C) aggravate this phenomenon. Heating the individual component to 50 to 60°C while stirring can usually restore products to original state. Storage at 25 +/- 10°C is optimum for most products.