ResinLab

ResinLab® RC8003 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8009 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8020 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8035 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8038 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8040 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8041 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8048 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

Resinlab® SEC1222 Part A is a silver filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high electrical conductivity starting immediately after mixing that improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

Resinlab® SEC1233 Part A is a silver filled, two component, room temperature curing epoxy adhesive. SEC1233 has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. It also can be packaged in small side-by-side dispensing cartridges for use with static mixers. This system is also available in a pre-mixed and frozen format. SEC1233 provides exceptionally high conductivity starting immediately after mixing and improves during the curing process. It also has high thermal conductivity due to its high silver content. It provides environmental protection and has tenacious adhesion to various metals and other common assembly materials.

Resinlab® SEC1244 Part A is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product will cure very quickly at high temperatures. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

Resinlab® EP1026 Black Part A is a two-part, unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material and is free-flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026 Black was formulated to a 1A:1B by volume mix ratio for use in either meter/mix and dispense equipment or side-by-side dual cartridges for easy dispensing. Handling cure is normally achieved at room temperature within 20-30 minutes with full cure in 24 hours. Because of the fast and exothermic reaction process, this product should only be used in small volumes.