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ResinLab® EP1026T3 Part A

1 of 20 products in this brand
ResinLab® EP1026T3 Part A is a two-part unfilled epoxy adhesive designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material. The thixotropic paste consistency prevents running and sagging. This formula will have good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026T3 CLEAR was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1026T3 CLEAR will reach handle cure at room temperature within 20-30 minutes and full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. Times and temperatures are listed below. Time to heat substrate must be considered. Cooler temperatures will also extend work time and increase cure times.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Ceramic, Metal, Plastics

Cure Method: Air Dry

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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
Instructions
  • Bring both components to room temperature prior to mixing.
  • Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Dissipation Factor (at 100 Hz)0.05-ASTM D150
Mix Ratio (By Weight)1.02:1--
Mix Ratio (By Volume)1:1--
Cure Schedule (at 65°C)30.0min-
Cure Schedule (at 100°C)30.0min-
Viscosity (Part A,Rheometer parallel plate 25mm at 1/s)720000.0cps-
Viscosity (Part B,Rheometer parallel plate 25mm at 1/s)560000.0cps-
Viscosity (Mixed Rheometer parallel plate 25mm at 1/s)485000.0cps-
Specific Gravity (Part A)1.19--
Specific Gravity (Part B)1.17--
Specific Gravity (Mixed)1.18--
Pot Life (Defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm at 1/s)5.0min-
Glass Transition Temperature (Tg)30.0°CDSC
Hardness80.0Shore DASTM D2240
Water Absorption (after 24 hours)0.78%ASTM D570
Peak Exotherm (after 7 minutes for 40mL sample)148.0°CType K thermocouple
Tensile Strength3000.0psiASTM D638
Tensile Elongation20.0%ASTM D638
Tensile Modulus240000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)2600.0psiASTM D1002
Compressive Yield Strength26000.0psiASTM D695
Compressive Strength39000.0psiASTM D695
Compressive Modulus183000.0psiASTM D695
Flame ResistancePasses Resinlab testing with HB rating at 6.0mm thickness. Not UL Certified.-UL94
Surface Resistivity (at 20%RH)8.30 x 1013Ω·cmASTM D257
Volume Resistivity (at 21°C)3.60 x 1014Ω·cmASTM D257
Dielectric Constant (at 100 Hz)4.6-ASTM D150
Dielectric Constant (at 100 Hz)4.0-ASTM D150
AC Dielectric Strength (at 100 Hz)410.0V/mil-
Coefficient of Thermal Expansion (by TMA, 5°C/min, below Tg)49.0ppm/°CASTM E831
Coefficient of Thermal Expansion (by TMA, 5°C/min, above Tg)216.0ppm/°CASTM E831
Operating Temperature Range-40 to 80°C-

Storage & Handling

Shelf Life And Storage
  • 12 months at 25 °C
  • Specialty packaging may be less.
  • Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is