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ResinLab® EP1056LC Black Part A

1 of 20 products in this brand
Resinlab® EP1056LC Black Part A is a two-part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling ability and prevent running and sagging during cure. It has very good resistance to water, acids and bases and most organic solvents. EP1056LC Black was formulated to a 2A:1B by volume mix ratio for use in side by side dispensing cartridges and meter/mix and dispense equipment. It will reach handle cure at room temperature within 8 – 16 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 65°C to 10 minutes at 100°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Metal, Plastics

Cure Method: Air Dry

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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Cure Method
Instructions
  • Bring both components to room temperature prior to mixing.
  • Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B
Dissipation Factor (at 100 Hz)0.007ASTM D150
Dissipation Factor (at 100 Hz)0.01ASTM D150
Mix Ratio (By Weight)2.38 : 1
Mix Ratio (By Volume)2:1
Cure Schedule (at 25°C)8.0 - 16.0h
Cure Schedule (at 25°C)48.0h
Cure Schedule (at 65°C)2.0h
Cure Schedule (at 100°C)10.0min
Viscosity (Part A,Rheometer parallel plate 25mm at 1/s)375000.0cpsDCV6100723
Viscosity (Part B,Rheometer parallel plate 25mm at 1/s)6500.0cpsDCV6100723
Viscosity (Mixed Rheometer parallel plate 25mm at 1/s)88000.0cpsDCV6100723
Specific Gravity (Part A)1.27
Specific Gravity (Part B)1.07
Specific Gravity (Mixed)1.2
Pot Life (Defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm)45.0minDCV6100723
Gel Time (40g sample)3.5h
Glass Transition Temperature (Tg)38.0°CDSC
Hardness80.0Shore DASTM D2240
Water Absorption (after 24 hours)0.05%ASTM D570
Peak Exotherm (after 48 minutes for 40mL sample)55.0°CType K thermocouple
Tensile Strength5000.0psiASTM D638
Tensile Elongation2021-02-03%ASTM D638
Tensile Modulus320000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)2800.0psiASTM D1002
Compressive Yield Strength9500.0psiASTM D695
Compressive Strength30000.0psiASTM D695
Compressive Modulus105000.0psiASTM D695
Flame ResistancePasses Resinlab testing with HB rating at 6.0mm thickness. Not UL Certified.UL94
Thermal Conductivity (by Transient Plane Heat Source)0.26W/mKISO 22007-2
Surface Resistivity (at 24% RH)2.8 x 1016Ω·cmASTM D257
Volume Resistivity (at 23°C)6.0 x 1015Ω·cmASTM D257
Dielectric Constant (at 100 Hz)2.9ASTM D150
Dielectric Constant (at 100 Hz)2.8ASTM D150
Coefficient of Thermal Expansion (by TMA, 5°C/min, below Tg)75.0ppm/°CASTM E831
Coefficient of Thermal Expansion (by TMA, 5°C/min, above Tg)203.0ppm/°CASTM E831
Operating Temperature Range-40 to 150°C
Relative Thermal Index (RTI)90.0°CUL746B

Packaging & Availability

Packaging Type

Storage & Handling

Shelf Life And Storage
  • 12 months at 25 °C
  • Specialty packaging may be less.
  • Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50°C) aggravate this phenomenon. Heating the individual component to 50 to 60°C while stirring can usually restore products to original state. Storage at 25 +/- 10°C is optimum for most products.