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ResinLab® EP1115 Clear Part A

1 of 20 products in this brand
Resinlab® EP1115 Clear Part A is a two-part unfilled epoxy adhesive designed for bonding metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. This product will have better water and temperature resistance than standard “5-minute” epoxy adhesives. EP1115 Clear was formulated to a 1A:1B volume mix ratio for use in side by side dispensing cartridges and meter/mix and dispense equipment. A handling cure is normally achieved at room temperature within 1 – 2 hours with full cure properties reached in 24 hours. Cure time can be accelerated by the application of heat to reach final cure properties quickly. Times of 30 minutes at 65 °C to 10 minutes at 100 °C is typical for most applications. Cooler temperatures will extend work time and increase cure times.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Ceramic, Metal, Plastics

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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Instructions
  • Bring both components to room temperature prior to mixing.
  • Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Dissipation Factor (at 100 Hz)0.009-ASTM D150
Dissipation Factor (at 100 Hz)0.026-ASTM D150
Mix Ratio (By Weight)1.10:1--
Mix Ratio (By Volume)1:1--
Cure Schedule (at 25°C)24.0h-
Cure Schedule (at 65°C)30.0min-
Cure Schedule (at 100°C)10.0min-
Viscosity (Part A,Rheometer parallel plate 25mm at 1/s)14000.0cps-
Viscosity (Part B,Rheometer parallel plate 25mm at 1/s)42000.0cps-
Viscosity (Mixed Rheometer parallel plate 25mm at 1/s)30000.0cps-
Specific Gravity (Part A)1.16--
Specific Gravity (Part B)1.05--
Specific Gravity (Mixed)1.11--
Pot Life (Defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm at 1/s)3.0min-
Gel Time (100cc sample)6.0 - 7.0min-
Glass Transition Temperature (Tg)43.0°CDSC
Hardness80.0Shore DASTM D2240
Water Absorption (after 24 hours)0.3%ASTM D570
Peak Exotherm (after 7.5 minutes for 40mL sample)132.0°CType K thermocouple
Tensile Strength5000.0psiASTM D638
Tensile Elongation6.0%ASTM D638
Tensile Modulus240000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)1500.0psiASTM D1002
Compressive Yield Strength10000.0psiASTM D695
Compressive Strength25000.0psiASTM D695
Compressive Modulus150000.0psiASTM D695
Flame ResistancePasses Resinlab testing with HB rating at 6mm thickness. Not UL Certified.-UL94
Thermal Conductivity (by LFA)max. 0.2W/mKASTM E1461
Surface Resistivity (at 19.7% RH)1.24 x 1017Ω·cmASTM D257
Volume Resistivity (at 20°C)9.56 x 1015Ω·cmASTM D257
Dielectric Constant (at 100 Hz)3.3-ASTM D150
Dielectric Constant (at 100 Hz)3.1-ASTM D150
AC Dielectric Strength410.0V/milASTM D149 Method A
Coefficient of Thermal Expansion (by TMA, 5°C/min, below Tg)67.0ppm/°CASTM E831
Coefficient of Thermal Expansion (by TMA, 5°C/min, above Tg)207.0ppm/°CASTM E831
Temperature Rating-40 to 130°C-

Packaging & Availability

Packaging Type

Storage & Handling

Shelf Life And Storage
  • 12 months at 25 °C
  • Specialty packaging may be less.
  • Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is optimum for most products.