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ResinLab® SEC1222 Part A

1 of 20 products in this brand
Resinlab® SEC1222 Part A is a silver filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high electrical conductivity starting immediately after mixing that improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces: Metal

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Instructions
  • Bring both components to room temperature prior to mixing. Stir to assure homogeneous consistency.
  • Weigh and mix parts A and B accurately and thoroughly, scraping sides of container. Often small amounts are mixed by laying out equal length beads on a glass slide and using a metal spatula to mix.
  • Allow to cure undisturbed.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Mix Ratio (By Weight)1:1--
Mix Ratio (By Volume)1:1--
Cure Schedule (at 25°C)24.0 - 72.0h-
Cure Schedule (at 60°C)1.0h-
Viscosity (Mixed, Rheometer parallel plate 25mm at 1/s)560000.0cps-
Specific Gravity (Part A)3.88--
Specific Gravity (Part B)3.93--
Specific Gravity (Mixed)3.91--
Pot Life45.0min-
Glass Transition Temperature (Tg)17.0°CDSC
Hardness70.0Shore DASTM D2240
Water Absorption (after 24 hours)0.1%ASTM D570
Tensile Strength1000.0psiASTM D638
Tensile Elongation3.0 - 5.0%ASTM D638
Tensile Modulus50000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)850.0psiASTM D1002
Compressive Yield Strength1300.0psiASTM D695
Compressive Strength9900.0psiASTM D695
Compressive Modulus65000.0psiASTM D695
Thermal Conductivity (by LFA)3.9W/mKASTM E1461
Volume Resistivity (Cured, 8 hours at 25°C)0.003Ω·cmASTM D257
Coefficient of Thermal Expansion (by TMA,below Tg)66.0ppm/°CASTM E831
Coefficient of Thermal Expansion (by TMA,above Tg)160.0ppm/°CASTM E831
Temperature Range-40 to 150°C-

Storage & Handling

Shelf Life And Storage
  • 6 months at 25°C
  • As one-part pre-mixed and frozen: 6 months DOP at -40 °C
  • Specialty packaging may be less.
  • NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35°C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50°C and stir until uniform.