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ResinLab® SEC1233 Part A

1 of 20 products in this brand
Resinlab® SEC1233 Part A is a silver filled, two component, room temperature curing epoxy adhesive. SEC1233 has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. It also can be packaged in small side-by-side dispensing cartridges for use with static mixers. This system is also available in a pre-mixed and frozen format. SEC1233 provides exceptionally high conductivity starting immediately after mixing and improves during the curing process. It also has high thermal conductivity due to its high silver content. It provides environmental protection and has tenacious adhesion to various metals and other common assembly materials.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces: Metal

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Instructions
  • Bring both components to room temperature prior to mixing. Stir to assure homogeneous consistency.
  • Weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Small amounts can be mixed by dispensing out equal length beads on a glass slide and using a metal spatula to mix.
  • Allow to cure undisturbed until product is fully gelled or tack-free to the touch.
  • Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Mix Ratio (By Weight)1:1--
Mix Ratio (By Volume)1:1--
Cure Schedule (Full cure at room temperature in 24-72 hours,at 60°C)1.0h-
Viscosity (Mixed at 2.5 rpm)172000.0cps-
Viscosity (Mixed at 5.0 rpm)82250.0cps-
Viscosity (Mixed at 10.0rpm)29500.0cps-
Viscosity (Mixed at 1/s)582000.0cps-
Specific Gravity (Part A)3.88--
Specific Gravity (Part B)3.97--
Pot Life (Defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm at 1/s)min. 4h-
Glass Transition Temperature (Tg)10.0°CDSC
Hardness70.0Shore DASTM D2240
Water Absorption (after 24 hours)max. 0.2%ASTM D570
Tensile Strength450.0psiASTM D638
Tensile Elongation20-30%ASTM D638
Tensile Modulus10000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)600.0psiASTM D1002
Compressive Yield Strength2000.0psiASTM D695
Compressive Strength9000.0psiASTM D695
Compressive Modulus11000.0psiASTM D695
Thermal Conductivity (by LFA)4.65W/mKASTM E1461
Volume Resistivity (Cured, 1 hours at 60°C)0.0016Ω·cm-
Volume Resistivity (Cured, 24 hours at 25°C)0.0016Ω·cm-
Volume Resistivity (Cured, 96 hours at 25°C)0.0009Ω·cm-
Coefficient of Thermal Expansion (by TMA,below Tg)63.0ppm/°CASTM E831
Coefficient of Thermal Expansion (by TMA,above Tg)120.0ppm/°CASTM E831
Temperature Range-40 to 150°C-