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ResinLab® SEC1244 Part A

1 of 20 products in this brand
Resinlab® SEC1244 Part A is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product will cure very quickly at high temperatures. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces: Metal

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Identification & Functionality

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Materials Features

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Compatible Substrates & Surfaces

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix RatioPart A to Part B--
Mix Ratio (By Weight)1.05:1--
Mix Ratio (By Volume)1:1--
Cure Schedule (at 150°C)5.0min-
Cure Schedule (at 120°C)15.0min-
Cure Schedule (at 100°C)60.0min-
Viscosity (Mixed at 2.5 rpm)234000.0cps-
Viscosity (Mixed at 5 rpm)126000.0cps-
Viscosity (Mixed Rheometer parallel plate 25mm at 1/s)298000.0cps-
Specific Gravity (Part A)4.09--
Specific Gravity (Part B)4.33--
Specific Gravity (Mixed)4.21--
Pot Life (Rheometer parallel plate 25mm at 1/s)min. 4h-
Glass Transition Temperature (Tg)98.0°CDSC
Hardness90.0Shore DASTM D2240
Water Absorption (after 24 hours)max. 0.2%ASTM D570
Tensile Strength5000.0psiASTM D638
Tensile Elongation2021-01-02%ASTM D638
Tensile Modulus600000.0psiASTM D638
Lap Shear Strength (0.010” bond line Al to Al)500.0psiASTM D1002
Compressive Yield Strength10500.0psiASTM D695
Compressive Strength13500.0psiASTM D695
Compressive Modulus750000.0psiASTM D695
Thermal Conductivity (by LFA)3.0W/mKASTM E1461
Volume Resistivity (Cured, 15 minutes at 120°C)0.0006Ω·cmASTM D257
Coefficient of Thermal Expansion (by TMA,below Tg)40.0ppm/°CASTM E831
Temperature Range-40 to 180°C-