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CuClad® 217 Laminates

1 of 5 products in this brand
CuClad 217(Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lo west di electric constant and di ssipation factor available in fiberglass reinforced PTFE based laminates. Together, these prop erties offer fas ter signal propagati on and higher signal/noise ratios.

Functions: Laminate

Reinforcement Material: Glass Fibers

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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Reinforcement Material
Composite Materials Functions

Features & Benefits

Features
  • Cross Plied Woven Fiberglass, alternating plies are oriented 90o to each other
  • High PTFE to Glass Ratio
  • Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates
Benefits
  • Electrical and Mechanical Isotropy in the X-Y Plane
  • Extremely Low Loss
  • Well Suited for Er Sensitive Circuits

Applications & Uses

Recommended Applications
  • Military Electronics (Radars, ECM, ESM)
  • Microwave Components (LNAs, filters, couplers, etc.)

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant at 10GHz2.17, 2.20-IPC TM-650 2.5.5.5
Surface Resistivity3.4 x 10^6MΩIPC TM-650 2.5.17.1
Dielectric Constant at 1MHz2.17, 2.20-IPC TM-650 2.5.5.3
Volume Resistivity2.3 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Dissipation Factor tan d, at 10 GHz0.0009-IPC TM-650 2.5.5.5
Thermal Coefficient of εr-151ppm/°CIPC TM-650 2.5.5.5 Adapted
Peel Strength14lb/inIPC TM-650 2.4.8
Arc Resistancemin. 180secondsASTM D-495
Tensile Modulus275, 219kpsiASTM D-638
Tensile Strength8.8, 6.6kpsiASTM D-882
Compressive Modulus237kpsiASTM D-695
Flexural Modulus357kpsiASTM D-790
Dielectric Breakdownmin. 45kVASTM D-149
Specific Gravity2.23g/cm3ASTM D-792 Method A
Water Absorption0.02%MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2
Coefficient of Thermal Expansion - X Axis29ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion - Y Axis28ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion Z Axis246ppm/°CIPC TM-650 2.4.24
Thermal Conductivity0.261-ASTM E-1225
Outgassing Total Mass Loss0.01%NASA SP-R-0022A
Outgassing Collected Volatile Condensable Material0.01%NASA SP-R-0022A
Outgassing Water Vapor Regain0%NASA SP-R-0022A

Technical Details & Test Data

Dielectric Constant vs. Frequency

CuClad® 217 Laminates - Dielectric Constant Vs. Frequency

Demonstrates the Stability of Dielectric Constant across Frequency. This information was correlated from data generated by using a free space and circular resonator cavity. This characteristic demonstrates the inherent robustness of Arlon Laminates across Frequency, thus simplifying the final design process when working across the EM spectrum. The stability of the Dielectric Constant of CuClad 217 over frequency ensures easy design transition and scalability of the design.

Packaging & Availability

Material Availability

CuClad laminates ar e suppli ed with 1/2, 1 or 2 oun ce electrodeposi ted copper on both s ides. Other copper wei ghts and rolle d cop per foil are avai lable. CuClad i s avai lable bonded t o a heavy metal ground plane. Aluminum, brass or cop per plates also provi de an i ntegral heat sink and mechanical support to the substrate. When ordering CuClad products please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.