Products

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing.

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

CuClad 217(Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lo west di electric constant and di ssipation factor available in fiberglass reinforced PTFE based laminates. Together, these prop erties offer fas ter signal propagati on and higher signal/noise ratios.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

CuClad 250(Er=2.40–2.60) uses a hi gher fiberglass/PTFE ratio to prov ide mechanical properties approac hing those of conventional subs trates. Better di mensional stabi lity and lower thermal expansi on in all di rections are other si gnificant benefi ts. The el ectrical properti es of CuCl ad 250GT and CuClad 250GXare tested at 1MHz and 10GHz respectively. For cri tical perform ance appli cations, CuCl ad products may be specified with an “LX” testing grade; this designates that each sheet will be tested individually, and a te st report will be issued with the order.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. RO3000series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

RT/duroid® 6006/6010LM microwave laminates are ceramicPTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2

RO4830™ thermoset laminates are well suited for price-sensitive millimeter wave applications, such as 76-81 GHz automotive radar sensors, and are a reliable, lower cost alternative to conventional PTFE-based laminates. RO4830 laminates have a slightly higher dielectric constant of 3.2 at 77GHz, versus PTFE-woven glass laminates. LoPro® reverse treated copper foil cladding contributes to RO4830 laminates’ excellent insertion loss at 77GHZ of 2.2 db per inch.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

Er=2.33) uses a higher fiberglass/PTFE ratio for a more highly reinforced combination that offers better dimensional stability and increased mechanical strength.

RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates.

Arlon’s TC600 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC600 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

CuClad 233(Er=2.33) uses a medi um fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

DiClad 527 (Er=2.40−2.65) use a higher fiberglass/PTFE ratio to provide mechanical properties approaching conventional substrates. Other advantages include better dimensional stability and lower thermal expansion in all directions. The electrical properties of DiClad 527 are tested at 1MHz and 10GHz, respectively.

IsoClad 917 (Er=2.17, 2.20) uses a low ratio of fiberglass/PTFE to achieve the lowest dielectric constant and dissipation factor available in a combination of PTFE and fiberglass.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications.

RO3003G2™ high-frequency ceramic-filled PTFE laminates are an extension of Rogers’ industry leading RO3003™ solutions. RO3003G2 laminates are based on industry feedback to address the next generation needs for mm-wave automotive radar applications.

TC350 is a woven fiberglass reinforced, ceramic filled, PTFEbased composite for use as a printed circuit board substrate. TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/ mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication.

DiClad laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precise control of the fiberglass/PTFE ratio, DiClad laminates offer a range of choices from the lowest dielectric constant and dissipation factor to a more highly reinforced laminate with better dimensional stability