Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Features
- Cross Plied Woven Fiberglass, alternating plies are oriented 90o to each other
- High PTFE to Glass Ratio
- Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates
- Benefits
- Electrical and Mechanical Isotropy in the X-Y Plane
- Extremely Low Loss
- Well Suited for Er Sensitive Circuits
Applications & Uses
- Markets
- Recommended Applications
- Military Electronics (Radars, ECM, ESM)
- Microwave Components (LNAs, filters, couplers, etc.)
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant at 10GHz | 2.33 | — | IPC TM-650 2.5.5.5 |
| Surface Resistivity | 2.4 x 10^6 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 1MHz | 2.33 | — | IPC TM-650 2.5.5.3 |
| Volume Resistivity | 8 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0013 | — | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -171 | ppm/°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength | 14 | lb/in | IPC TM-650 2.4.8 |
| Arc Resistance | min. 180 | seconds | ASTM D-495 |
| Tensile Modulus | 510, 414 | kpsi | ASTM D-638 |
| Tensile Strength | 10.3, 9.8 | kpsi | ASTM D-882 |
| Compressive Modulus | 276 | kpsi | ASTM D-695 |
| Flexural Modulus | 371 | kpsi | ASTM D-790 |
| Dielectric Breakdown | min. 45 | kV | ASTM D-149 |
| Specific Gravity | 2.26 | g/cm3 | ASTM D-792 Method A |
| Water Absorption | 0.02 | % | MIL-S-13949H 3.7.7 and IPC TM-650 2.6.2.2 |
| Coefficient of Thermal Expansion - X Axis | 23 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion - Y Axis | 24 | ppm/°C | IPC TM-650 2.4.24 |
| Coefficient of Thermal Expansion Z Axis | 194 | ppm/°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.258 | — | ASTM E-1225 |
| Outgassing Total Mass Loss | 0.01 | % | NASA SP-R-0022A |
| Outgassing Collected Volatile Condensable Material | 0.01 | % | NASA SP-R-0022A |
| Outgassing Water Vapor Regain | 0 | % | NASA SP-R-0022A |
Packaging & Availability
- Material Availability
CuClad laminates ar e suppli ed with 1/2, 1 or 2 oun ce electrodeposi ted copper on both s ides. Other copper wei ghts and rolle d cop per foil are avai lable. CuClad i s avai lable bonded t o a heavy metal ground plane. Aluminum, brass or cop per plates also provi de an i ntegral heat sink and mechanical support to the substrate. When ordering CuClad products please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.