Knowde Enhanced TDS
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Features
- Woven glass reinforcement
- Improves rigidity for easier handling Uniform electrical and mechanical performance
- Ideal for complex multi-layer high frequency structures Low in-plane expansion coefficient (matched to copper)
- Suitable for use with epoxy multi-layer board hybrid designs
- Reliable surface mounted assemblies
- Excellent dimensional stability
- High production yields Economically priced
- Cost effective volume manufacturing Surface smoothness
- Allows for finer line etching tolerances
- Product Highlights
RO3210™ high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability. RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques as described in the application note, “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.” The dielectric constant of RO3210 high frequency circuit materials is 10.2 with a dissipation factor of 0.0027. RO3200 series laminates are manufactured under an ISO 9002 certified quality system.
Applications & Uses
- Applications
- Recommended Applications
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process | 10.2± 0.50 | — | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Surface Resistivity | 1 x 10^3 | MΩ | IPC 2.5.17.1 |
| Dielectric Constant, εr, Design | 10.8 | — | Differential Phase Length Method |
| Volume Resistivity | 1 x 10^3 | MΩ-cm | IPC 2.5.17.1 |
| Dissipation Factor, tan d | 0.0027 | — | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -459 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability - X axis | 0.8 | mm/m | IPC TM-650 2.2.4 |
| Dimensional Stability - Y axis | 0.8 | mm/m | IPC TM-650 2.2.4 |
| Tensile Modulus (MD) | 579 | kpsi | ASTM D638 |
| Tensile Modulus (CMD) | 517 | kpsi | ASTM D638 |
| Water Absorption | max. 0.1 | % | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | J/g/°K | — |
| Thermal Conductivity | 0.81 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 13 | ppm/°C | ASTM D3386-94 |
| Coefficient of Thermal Expansion - Y Axis | 13 | ppm/°C | ASTM D3386-94 |
| Coefficient of Thermal Expansion Z Axis | 34 | ppm/°C | ASTM D3386-94 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 3 | g/cm3 | ASTM D792 |
| Copper Peel Strength | 11 | lb/in | IPC-TM-2.4.8 |