Products

AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

DiClad laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precise control of the fiberglass/PTFE ratio, DiClad laminates offer a range of choices from the lowest dielectric constant and dissipation factor to a more highly reinforced laminate with better dimensional stability

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

RO4500™ Series High Frequency Laminates are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. RO4533™, RO4534™, and RO4535™ laminates extend the capabilities of the successful RO4000® product series into antenna applications. This ceramic-filled, glass-reinforced hydrocarbon based material set provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. RO3000series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

Er=2.33) uses a higher fiberglass/PTFE ratio for a more highly reinforced combination that offers better dimensional stability and increased mechanical strength.

Arlon’s TC600 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC600 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

RO4830™ thermoset laminates are well suited for price-sensitive millimeter wave applications, such as 76-81 GHz automotive radar sensors, and are a reliable, lower cost alternative to conventional PTFE-based laminates. RO4830 laminates have a slightly higher dielectric constant of 3.2 at 77GHz, versus PTFE-woven glass laminates. LoPro® reverse treated copper foil cladding contributes to RO4830 laminates’ excellent insertion loss at 77GHZ of 2.2 db per inch.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

RT/duroid® 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates.

RT/duroid® 6006/6010LM microwave laminates are ceramicPTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2

RO3210™ high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability

RT/duroid® 6202 high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

DiClad 527 (Er=2.40−2.65) use a higher fiberglass/PTFE ratio to provide mechanical properties approaching conventional substrates. Other advantages include better dimensional stability and lower thermal expansion in all directions. The electrical properties of DiClad 527 are tested at 1MHz and 10GHz, respectively.

RT/duroid® 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

IsoClad 917 (Er=2.17, 2.20) uses a low ratio of fiberglass/PTFE to achieve the lowest dielectric constant and dissipation factor available in a combination of PTFE and fiberglass.

RO3003G2™ high-frequency ceramic-filled PTFE laminates are an extension of Rogers’ industry leading RO3003™ solutions. RO3003G2 laminates are based on industry feedback to address the next generation needs for mm-wave automotive radar applications.

TC350 is a woven fiberglass reinforced, ceramic filled, PTFEbased composite for use as a printed circuit board substrate. TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

RO4000® hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes offered at competitive prices.

TC350™ Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/ mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board. Additionally, the advanced filler system used enables the composite to have much improved mechanical drilling performance when compared with other competitive laminates. This will result in lower manufacturing costs during circuit board fabrication.

RO4835T™ laminates are 3.3 Dk low loss, spread glass reinforced, ceramic thermoset materials that were designed as inner-layers for use in multilayer board designs, and to complement RO4835™ laminates when thinner cores are needed.