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RO4360G2™ Laminates

1 of 1 products in this brand
RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

Functions: Laminate

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Knowde Enhanced TDS

Identification & Functionality

Composite Materials Functions

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Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant, εr, Process6.15 ± 0.15IPC-TM-650 2.5.5.5 Clamped Stripline
Surface Resistivity9 x 10^12IPC-TM-650, 2.5.17.1
Dissipation Factor, tan d0.0038IPC-TM-650 2.5.5.5
Volume Resistivity4 x 10^15MΩ-cmIPC-TM-650, 2.5.17.1
Thermal Conductivity0.75W/m/°KASTM D-5470
Electrical Strength784V/milIPC-TM-650, 2.5.6.2
Tensile Strength19kpsiASTM D638
Tensile Strength14kpsiASTM D638
Flexural Strength31kpsiIPC-TM-650, 2.4.4
Flexural Strength21kpsiIPC-TM-650, 2.4.4
Coefficient of Thermal Expansion - X Axis13ppm/°CASTM D3386-94
Coefficient of Thermal Expansion - Y Axis14ppm/°CASTM D3386-94
Coefficient of Thermal Expansion Z Axis28ppm/°CASTM D3386-94
Tgmin. 280°C TMAIPC-TM-650 2.4.24.3
Decomposition Temperature (Td)407°CASTM D3850 using TGA
Time to Delamination (T288)min. 30minIPC-TM-650 2.4.24.1
Moisture Absorption0.08%IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of εr-131ppm/°CIPC-TM-650, 2.5.5.5
Density2.16g/cm3ASTM D792
Copper Peel Strength0.91N/mmIPC-TM-650 2.4.8