Knowde Enhanced TDS
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
As with all RO4000 high frequency laminates, RO4500 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. This product series is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 and RO4534 laminates are available halogen-free to meet the most stringent “green” standards, and RO4535 laminates are available with our RoHS-compliant flame-retardant technology for applications requiring UL94 V-0 certification. The resin systems of RO4500 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4500 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability. These properties, in combination with a dimensional stability value of less than 0.05%, make RO4500 laminates an excellent candidate for printed circuit antenna applications. RO4500 materials also provide increased thermal conductivity over equivalent PTFE/woven glass materials, allowing for design of antennas with increased power handling capability. In addition to these excellent thermo-mechanical properties, RO4500 laminates embody electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) ranging from 3.3 to 3.5 (±0.08) and a loss tangent (Df) of 0.0020 to 0.0037 measured at 2.5 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than –155 dBC using two 43 dBm swept tones at 1900 MHz.
- Features
Loss range (0.0020 to 0.0037), Dk range (3.3 to 3.5), low PIM response
- Wide range of application use Thermoset resin system
- Compatible with standard PCB fabrication
Excellent dimensional stability
- Greater yield on larger panels sizes Uniform mechanical properties
- Maintains mechanical form during handling High thermal conductivity
- Improved power handling
Applications & Uses
- Applications
- Recommended Applications
- Cellular infrastructure base station antennas
- WiMAX antenna networks
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process | 3.3 ± 0.08 | — | IPC-TM-650,2.5.5.5 |
| Dissipation Factor at 2.5 GHz | 0.002 | — | IPC-TM-650, 2.5.5.5 |
| Dissipation Factor tan d, at 10 GHz | 0.0025 | — | IPC-TM-650, 2.5.5.5 |
| PIM (Typical) | -157 | dBc | Summitek 1900b PIM Analyzer |
| Dielectric Strength | min. 500 | V/mil | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | max. 0.2 | mm/m | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion - X Axis | 13 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 11 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion Z Axis | 37 | ppm/°C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.6 | W/m/°K | ASTM C518 |
| Moisture Absorption | 0.02 | % | IPC-TM-650, 2.6.2.1 ASTM D57 |
| Tg | min. 280 | °C TMA | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | g/cm3 | ASTM D792 |
| Copper Peel Strength | 1.2 | N/mm | IPC-TM-650, 2.4.8 |