Knowde Enhanced TDS
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
Applications & Uses
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process | 3.48 ± 0.05 | — | IPC-TM-650, 2.5.5.5 |
| Surface Resistivity | 7 x 10^8 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dielectric Constant, εr, Design | 3.66 | — | Differential Phase Length Method |
| Volume Resistivity | 5 x 10^8 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0037 | — | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | 50 | ppm/°C | IPC-TM-650, 2.5.5.5 |
| Electrical Strength | 755 | V/mil | IPC-TM-650, 2.5.6.2 |
| Tensile Modulus | 1128 | kpsi | ASTM D638 |
| Tensile Strength | 19.7 | kpsi | ASTM D638 |
| Flexural Strength | 27 | kpsi | IPC-TM-650 2.4.4 |
| Dimensional Stability | max. 0.5 | mm/m | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion - X Axis | 10 | ppm/°C | IPC-TM-650, 2.1.24 |
| Coefficient of Thermal Expansion - Y Axis | 12 | ppm/°C | IPC-TM-650, 2.1.24 |
| Coefficient of Thermal Expansion Z Axis | 31 | ppm/°C | IPC-TM-650, 2.1.24 |
| Thermal Conductivity | 0.66 | W/m/°K | ASTM C518 |
| Moisture Absorption | 0.05 | % | ASTM D570 |
| Tg | min. 280 | °C | IPC-TM-650 2.4.24.3 |
| Decomposition Temperature (Td) | 390 | °C | ASTM D3850 |
| Density | 1.92 | g/cm3 | ASTM D792 |
| Copper Peel Strength | 0.88 | N/mm | IPC-TM-650 2.4.8 |