Knowde Enhanced TDS
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
The world has seen the ongoing evolution of mobile networks, GSM, WCDMA and LTE that has enabled users to grow data consumption at amazing rates and Rogers high frequency materials have played a key role in this market. Antennas, Power Amplifiers, and microwave backhaul radios are needed to create these mobile networks and dielectric constant controlled, low loss materials are the foundation on which this technology is based. High frequency materials are a key enabling technology in the development of the next generation mobile network, 5G which will reach frequencies well into millimeter wave bands where multilayer board designs are prevalent. RO4835T laminates' multiple thickness thin core options are fully compatible with RO4450F™ bondply, the new RO4450T™ thin bondplies, and CU4000™/CU4000 LoPro® foil lamination options. When coupled with RO4835 laminates and RO4000® bonding materials, these material sets provide designers flexibility to achieve requirements related to high multilayer board (MLB) count designs. RO4835T laminates offer the same resistance to oxidation as RO4835 laminates, are low loss, have excellent Dk tolerance, and a tight thickness control for outstanding, repeatable wireless performance. They feature high performance material attributes that provide the optimum blend of price, performance and durability, and can be fabricated using standard epoxy/glass (FR-4) processes. RO4835T laminates utilize RoHS compliant flame-retardant technology for applications requiring UL 94 V-0 certification. These materials conform to the requirements of IPC-4103, slash sheet / 240.
- Features
Significantly improved oxidation resistance compared to typical thermoset microwave materials
- Designed for performance sensitive, high volume applications.
Low loss
- Excellent electrical perfomance allows application with higher operating frequencies.
Spread Glass
- Minimizes local variation of dielectric constant.
Tight dielectric constant tolerance
- Controlled impedance transmission lines
Lead-free process compatible
- No blistering or delamination
Low Z-axis expansion
- Reliable plated through holes
Low in-plane expansion coefficient
- Remains stable over an entire range of circuit processing temperatures
CAF resistant
Applications & Uses
- Applications
- Recommended Applications
- Point-to-point Microwav
- Power Amplifiers
- Cellular infrastructure antennas
- Phased-Array Radar
- RF Components
- Test and Measurement
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process | 3.33 | — | IPC TM-650 2.5.5.5 [2] Clamped Stripline |
| Surface Resistivity | 1.17 x 10^6 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant, εr, Design | 3.52 | — | Differential Phase Length Method |
| Volume Resistivity | 1.34 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor | 0.003 | — | IPC TM-650 2.5.5.5 |
| Electrical Strength | 1320 | V/mil | IPC TM-650 2.5.6.2 |
| Decomposition Temperature (Td) | 389 | ºC TGA | IPC TM-650 2.3.40 |
| Tg | min. 280 | ºC TMA | IPC-TM-650 2.4.24.5 |
| Coefficient of Thermal Expansion - X Axis | 14 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 16 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion Z Axis | 62 | ppm/°C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.52 | W/m/°K | ASTM D5470 |
| Copper Adhesion | 3.9 | pli | IPC TM-650 2.4.8 |
| Flexural Strength - x | 226 | kpsi | IPC-TM-650 2.4.4 |
| Flexural Strength - y | 214 | kpsi | IPC-TM-650 2.4.4 |
| Tensile Strength | 163 | kpsi | ASTM D638 |
| Tensile Modulus | 11300 | kpsi | ASTM D638 |
| Dimensional Stability | max. 0.5 | mm/m | IPC-TM-650 2.4.39a |
| Density | 1.81 | g/cm3 | ASTM D792 |
| Moisture Absorption | 0.2 | % | IPC TM-650 2.6.2.1 |