Knowde Enhanced TDS
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
RT/duroid® 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. The thermal coefficient of dielectric constant is extremely low from -55o C to+150o C (-67°F to 302°F) which provides the designers of filters, oscillators and delay lines the electrical stability needed in today’s demanding applications. A low Z axis coefficient of thermal expansion (CTE) ensures excellent reliability of plated through-holes. RT/duroid 6002 materials have been successfully temperature cycled (-55o C to 125o C [-67°F to 257°F]) for over 5000 cycles without a single via failure. Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances. The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal, (6 ppm/o C) further increasing surface mount reliability. ½ oz. to 2 oz./ft.2 electrodeposited copper, ½ oz. to 1 oz. reverse treated electrodeposited copper or ½ oz. to 2 oz./ ft.2 rolled copper may be specified as cladding on dielectric thicknesses from 0.005” to 0.125” (0.13 to 3.18mm). RT/duroid 6002 laminate is also available clad with aluminum, brass, or copper plates and resistive foils.
Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such as antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments. RT/duroid 6002 laminates have Underwriters Laboratories recognition under classification 94V-0 (Vertical Flammability Test).- Features
Low Loss
- Excellent high frequency performance
Excellent mechanical and electrical properties
- Reliable multi-layer board constructions
- Extremely low thermal coefficient of dielectric constant
- Excellent dimensional stability
In-plane expansion coefficient matched to copper
- Allows for more reliable surface mounted assemblies
- Ideal for applications sensitive to temperature change
- Excellent dimensional stability
Low Z-axis expansion
- Reliable plated through-holes
Low outgassing
- Ideal for space applications
Applications & Uses
- Applications
- Recommended Applications
- Phased Array Antennas
- Ground Based and Airborne Radar Systems
- Global Positioning System Antennas
- Power Backplanes
- High Reliability Complex Multilayer Circuits
- Commercial Airline Collision Avoidance
- Beam Forming Networks
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process at 10 MHz | 2.94 ± 0.04 | - | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 1 x 10^7 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dielectric Constant, εr, Design | 2.94 | - | Differential Phase Length Method |
| Volume Resistivity | 1 x 10^6 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0012 | - | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | 12 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus | 120 | kpsi | ASTM D638 |
| Tensile Ultimate Stress | 1 | kpsi | ASTM D638 |
| Tensile Ultimate Strain | 7.3 | % | ASTM D638 |
| Compressive Modulus | 360 | kpsi | ASTM D638 |
| Moisture Absorption | 0.02 | % | IPC-TM-650, 2.6.2.1 and ASTM D570 |
| Thermal Conductivity | 0.6 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 16 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 16 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion Z Axis | 24 | ppm/°C | IPC-TM-650 2.4.41 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 2.1 | g/cm3 | ASTM D792 |
| Specific Heat | 0.93 | J/g/°K | - |
| Copper Peel | 1.6 | N/mm | IPC-TM-650 2.4.8 |