Knowde Enhanced TDS
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance weight sensitive applications. The very low dielectric constant of RT/duroid 5880LZ laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ laminates to Ku-band and above. RT/duroid 5880LZ laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes. When ordering RT/duroid 5880LZ laminates, it is important to specify dielectric thickness, tolerance, electrodeposited copper foil, and weight of copper foil required.
- Product Highlights
RT/duroid® 6202 high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances. ½ oz. to 2 oz./ft.2 electrodeposited and rolled copper foil may be specified as cladding on dielectric thicknesses from 0.005” to 0.060” (0.127 to 1.524 mm). Applications particularly suited to the unique properties of RT/duroid 6202 material include flat and non-planar structures such as antennas and complex multilayer circuits with interlayer connections.
- Features
- Lowest electrical loss for reinforced
- PTFE material
- Low moisture absorption
- Isotropic
- Uniform electrical properties over frequency
- Excellent chemical resistance
Applications & Uses
- Applications
- Recommended Applications
- Commercial Airline Broadband
- Antennas Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Military Radar Systems
- Missile Guidance Systems
- Point to Point Digital Radio Antennas
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, at 10 MHz | 2.90 ± 0.04 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 1 x 10^9 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0015 | — | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1 x 10^6 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Thermal Coefficient of εr | 5 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus | 146 | kpsi | ASTM D638 |
| Tensile Ultimate Stress | 4.3 | kpsi | ASTM D638 |
| Tensile Ultimate Strain | 4.9 | % | ASTM D638 |
| Compressive Modulus | 150 | kpsi | ASTM D695 |
| Moisture Absorption | 0.04 | % | ASTM D570 |
| Thermal Conductivity | 0.68 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 15 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion - Y Axis | 15 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion Z Axis | 30 | ppm/°C | IPC-TM-650 2.1.41 |
| Dimensional Stability | 0.07 | mm/m | IPC-TM-650, 2.4.39 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 2.1 | g/cm3 | ASTM D792 |
| Specific Heat | 0.93 | J/g/°K | — |
| Copper Peel | 1.6 | N/mm | IPC-TM-650 2.4.8 |