Knowde Enhanced TDS
Identification & Functionality
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
RT/duroid® 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This enables the manufacture of tight tolerance planar resistors. ¼ oz. to 2 oz./ft.2 electrodeposited copper foil , ½ oz., 1 oz. and 2 oz. rolled copper foil, ½ oz., 1oz. and 2 oz. reverse treated foil and ½ oz. and 1 oz. electrodeposited copper foil with a resistive layer, may be specifi ed as cladding on 0.005” (0.127mm), 0.010” (0.254mm), 0.015” (0.381mm), & 0.020” (0.508mm) standard dielectric thicknesses. RT/duroid 6002PR (non-reinforced) available in 0.020 and 0.030 dielectric thicknesses. Applications particularly suited to the unique properties of RT/duroid 6202PR material include fl at and non-planar structures such as antennas and complex multi-layer circuits with inter-layer connections
- Features
Low Loss
- Excellent high frequency performance
Excellent mechanical and electrical properties
- Reliable multi-layer board constructions
Tight dielectric constant and thickness controls
- Extremely low thermal coeffi cient of dielectric constant
- Excellent dimensional stability
In-plane expansion coeffi cient matched to copper
- Allows for more reliable surface mounted assemblies
- Ideal for applications sensitive to temperature change
- Excellent dimensional stability
Applications & Uses
- Applications
- Recommended Applications
- Phased Array Antennas
- Ground Based and Airborne Radar Systems
- Global Positioning System Antennas
- Power Backplanes
- High Reliability Complex Multi-layer Circuits
- Commercial Airline Collision Avoidance
- Beam Forming Networks
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Dielectric Constant, εr, Process and Design at 10 MHz | 2.90 ± 0.04 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 1 x 10^9 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.002 | — | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1 x 10^10 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Thermal Coefficient of εr | 13 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus | 146 | kpsi | ASTM D638 |
| Tensile Ultimate Stress | 4.3 | kpsi | ASTM D638 |
| Tensile Ultimate Strain | 4.9 | % | ASTM D638 |
| Compressive Modulus | 150 | kpsi | ASTM D695 |
| Moisture Absorption | 0.1 | % | ASTM D570 |
| Thermal Conductivity | 0.68 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 15 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion - Y Axis | 15 | ppm/°C | IPC-TM-650 2.1.41 |
| Coefficient of Thermal Expansion Z Axis | 30 | ppm/°C | IPC-TM-650 2.1.41 |
| Decomposition Temperature (Td) | 500 | °C TGA | ASTM D3850 |
| Density | 2.1 | g/cm3 | ASTM D792 |
| Specific Heat | 0.93 | J/g/°K | — |
| Dimensional Stability | 0.07 | mm/m | IPC-TM-650, 2.4.39 |