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LNP™ THERMOCOMP™ Compound 5C003

1 of 486 products in this brand
LNP™ THERMOCOMP™ Compound 5C003 is a Polyvinylidene Fluoride (PVDF) resin-based compound with 15% carbon fiber, offering electrically conductive properties. It is characterized by its high stiffness and strength, making it ideal for applications in electrical and electronics, energy management, electronic components, and industrial material handling. This compound is processed through injection molding.

Polymer Name: Polyvinylidene Fluoride (PVDF)

Processing Methods: Injection Molding

Fillers Included: Carbon Fiber

Technical Data Sheet

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Stress (Break) ¹¹67MPaISO 527
Tensile Stress (Break) ¹¹78MPaASTM D638
Tensile Strain (Break) ¹¹0.8%ASTM D638
Tensile Strain (Break) ¹¹0.6%ISO 527
Tensile Modulus (at 5 mm/min) ¹¹14270MPaASTM D638
Flexural Stress ¹¹147MPaISO 178
Flexural Stress ¹¹127MPaASTM D790
Flexural Modulus ¹¹11790MPaASTM D790
Flexural Modulus ¹¹20920MPaISO 178
Tensile Modulus (at 1 mm/min) ¹¹14500MPaISO 527
Physical Properties
ValueUnitsTest Method / Conditions
Density ¹¹1.76g/cm³ISO 1183
Density ¹¹1.769g/cm³ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹0.03%ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.3 - 0.5%ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.36%ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹1 - 1.3%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹1.16%ISO 294
Moisture Absorption (at 23°C, 50% RH) ¹¹0.04%ISO 62
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹165°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹159°CASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.00003131/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.00003131/°CISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.00008621/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.00008621/°CISO 11359-2
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹165°CISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹156°CISO 75/Af
Impact Properties
ValueUnitsTest Method / Conditions
Izod Impact (Unnotched, at 23°C) ¹¹202J/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹58J/mASTM D256
Instrumented Dart Impact Energy (Peak, at 23°C) ¹¹11JASTM D3763
Multi-Axial Impact ¹¹3JISO 6603
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹14kJ/m²ISO 180/1U
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹6kJ/m²ISO 180/1A
Injection Molding
ValueUnitsTest Method / Conditions
Drying Temperature ⁷120 - 150°C
Drying Time ⁷4Hrs
Melt Temperature ⁷215 - 230°C
Front - Zone 3 Temperature ⁷225 - 245°C
Middle - Zone 2 Temperature ⁷210 - 225°C
Rear - Zone 1 Temperature ⁷190 - 210°C
Mold Temperature ⁷65 - 90°C
Back Pressure ⁷0.2 - 0.3MPa
Screw Speed ⁷30 - 60rpm
Note
  • ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.
  • ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
  • ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
 

Packaging & Availability

Regional Availability
  • Americas
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  • North America