Knowde Enhanced TDS
Identification & Functionality
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Characteristics
EP1641 is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding and potting adhesive for electronic applications. It is a readily usable one-part that cures at elevated temperature to provide strong bonding to silicon, flip chip, BGA, ceramics, LTCC, aluminum, copper, stainless steel, etc. The very low CTE formulation provides better thermal cycle performances. Its strong oil and chemical resistance and high voltage insulation capability makes it ideal for electronic potting and encapsulation applications. EP1641 is flowable at both ambient and elevated cure temperature.
- Special Features & Benefits
- Low CTE for stress compliance
- High thermal stability
- High structural bonding strength
- Strong oil and chemical resistance
- Low bleeding, low volatile
- Low ionic content
Applications & Uses
- Applications
- Application Area
- Cure Method
- Typical Applications
- Aerospace electronics
- Automotive electronics
- Semiconductor and Telecommunications
- Bonding of die to LTCC, Al, Cu
- Bonding of power devices to heat sinks
- Structural bonding or potting
- Resistance to thermal vibration
- Potting and encapsulation for media protection
- Processing Instruction
- The adhesive is a pre-mixed adhesive as one part for easier applying. In order to keep longer usage life, please always store the original or left material in freezer (- 40°C). For some applications, it is recommended to warm the adhesive to about 50°C to promote easier flow. Any possible air bubbles can be removed by vacuum.
- We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
Properties
- Typical Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Density | 1.6 | Gram /cc | ASTM D792 |
| Viscosity (25°C) | 25000.0 | cps | ASTM D2196 |
| Value | Units | Test Method / Conditions | |
| Adhesion (Avai Lap Shear) | min. 1800 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion (Greater Tha Tg) | 68.0 | ppm/°C | IPC-TM-650 |
| Coefficient Of Thermal Expansion (Less Than Tg) | 19.0 | ppm/°C | IPC-TM-650 |
| Cure Time (125°C) | 45.0 | min | DSC |
| Cure Time (150°C) | 15.0 | min | DSC |
| Cure Time (80°C) | approx. 3 | Hr | DSC |
| Dielectric Strength | min. 500 | Volt/mil AC | ASTM D149 |
| Pot / Work Life (After Warmed Up, 25°C) | 8.0 | hr | Viscosity double |
| Temperature Usage | -80 to 200 | °C | TGA |
| Glass Transmission | 150.0 | °C | DMA |
| Volume Resistivity | min. 10E+12 | Ohm-cm | ASTM D257 |
| Young's Modulus | 8.9 | GPa | DMA |
Safety & Health
- Safety
General hygiene regulations should be observed.
Storage & Handling
- Storage
EP1641 has a shelf life of at least 6 months when stored at freezer (-40°C) in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.