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Valtron® AD1238A-AD3853B Epoxy System

1 of 48 products in this brand

Valtron® AD1238A-AD3853B Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for wafer slicing. Longer working time than AD1238-A / AD3848-B.

Product Type: 2K (2 component) Adhesive

Application Area: Photovolatics

Chemical Family: Epoxy & Epoxy Derivatives

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Identification & Functionality

Features & Benefits

Applications & Uses

Markets
Application Area
Application
  • Increased gel time version of AD1238-A /AD3848-BR system

Properties

Component A
ValueUnitsTest Method / Conditions
Viscosity (25°C)70000cps
Specific Gravity1.21
Mixing Ratio (By Weight)1
Component B
ValueUnitsTest Method / Conditions
Viscosity (25°C)23000cps
Specific Gravity1.31
Mixing Ratio (By Weight)1
Mixed System Properties
ValueUnitsTest Method / Conditions
Gel Time¹15minutes
Cure Time²4hrs
Working Time⁴10minutes
Hardness84Shore D
Bond Strength⁵ (4 hrs)min. 2,000psi
Bond Strength⁵ (8 hrs)min. 2,500psi
Glass Transition Temperature³35°C
Slurry CompatibilityPEG
Note

¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

Technical Details & Test Data

Demounting
Epoxy System Debonding Solution Temperature(°C) Time Required
AD1238-A
AD3853-B
Water 90 max. 20
Acetic Acid min. 30 max. 30
Citric Acid (>10% by wt.) min. 50 max. 30
VALTRON® DP164 (>12% by vol.) min. 50 max. 30
VALTRON® SP2500 min. 75 max. 20