Products

Valtron® AD1339A-AD3905B Epoxy System is a general temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and semiconductor wafer slicing process. Longer working time than AD1339-A / AD3939-B. Applicable for automatic dispensing systems.

Valtron® AD5038A-AD5038B Epoxy System is a low viscosity, temporary adhesive system ideal for slicing applications where polyethylene glycol (PEG), PEG/water and water coolant is used as a slicing vehicle or a coolant. It has good water resistance.

Valtron® AD1846A-AD1851B Epoxy System is a temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and LED wafer slicing process. It has good water resistance. Applicable for diamond wire saw with selected debonding solutions.

Valtron® AD1238A-AD3853B Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for wafer slicing. Longer working time than AD1238-A / AD3848-B.

Valtron® AD1339A-AD3939B Epoxy System is a general temporary adhesive system which offers a unique solution for adhering semiconductor and photovoltaic ingots to mounting fixtures and slicing beams.

Valtron® AD1238A-AD3848BR Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for the wafer slicing, fast-curing and high bond strength. Applicable for automatic dispensing systems.