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Valtron® AD1339A-AD3905B Epoxy System

1 of 48 products in this brand

Valtron® AD1339A-AD3905B Epoxy System is a general temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and semiconductor wafer slicing process. Longer working time than AD1339-A / AD3939-B. Applicable for automatic dispensing systems.

Product Type: 2K (2 component) Adhesive

Application Area: Photovolatics, Semiconductors

Chemical Family: Epoxy & Epoxy Derivatives

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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application
  • Increased gel time version of AD1339-A /AD3939-B system

Properties

Component A
ValueUnitsTest Method / Conditions
Viscosity (25°C)115000cps
Specific Gravity1.6
Mixing Ratio (By Weight)1
Component B
ValueUnitsTest Method / Conditions
Viscosity (25°C)45000cps
Specific Gravity1.47
Mixing Ratio (By Weight)1
Mixed System Properties
ValueUnitsTest Method / Conditions
Gel Time¹30minutes
Cure Time²4hrs
Working Time⁴20minutes
Hardness85Shore D
Bond Strength⁵ (4 hrs)2000psi
Bond Strength⁵ (8 hrs)2200psi
Glass Transition Temperature³40°C
Slurry CompatibilityPEG
Note

¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

Technical Details & Test Data

Demounting
Epoxy System Debonding Solution Temperature(°C) Time Required
AD1339-A
AD3905-B
Water 90 max. 20
Acetic Acid min. 30 max. 30
Citric Acid (>10% by wt.) min. 50 max. 30
VALTRON® DP164 (>12% by vol.) min. 50 max. 30
VALTRON® SP2500 min. 75 max. 20