Valtron AD1339A-AD3939B Epoxy System

Identification & Functionality

Chemical Family: Epoxy & Epoxy Derivatives
Product Type: 2K (2 component) Adhesive
Technologies: Ready-to-Use Products
Product Families: Ready-to-Use Products — Adhesives & Sealants
Other Adhesives & Sealants

Features & Benefits

Ready-to-Use Product Features: Cleanable,
Consistent Performance,
Excellent Substrate Adhesion,
Fast Curing,
Good Strength,
High Hardness

Applications & Uses

Markets: Electrical & Electronics,
Industrial
Applications: Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Industrial — Power, Water & Utilities
Renewable Energy
Application Area: Photovolatics,
Semiconductors
Application: Increased hardness system to prevent wire marks

Properties

Color: White,
Yellow
Component A
Component B
Mixed System Properties
Note: ¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.

	Value	Units	Test Method / Conditions
Gel Time¹	15	minutes	—
Cure Time²	2	hrs	—
Working Time⁴	10	minutes	—
Hardness	85	Shore D	—
Bond Strength⁵ (4 hrs)	2000	psi	—
Bond Strength⁵ (8 hrs)	min. 1,800	psi	—
Glass Transition Temperature³	40	°C	—
Slurry Compatibility	PEG	—	—

Technical Details & Test Data

Demounting: Epoxy System Debonding Solution Temperature(°C) Time Required

AD1339-A
AD3939-B Water 90 max. 20

Acetic Acid min. 30 max. 30

Citric Acid (>10% by wt.) min. 50 max. 30

VALTRON® DP164 (>12% by vol.) min. 50 max. 30

VALTRON® SP2500 min. 75 max. 20

Valtron® AD1339A-AD3939B Epoxy System