Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
Applications & Uses
- Applications
- Application Area
- Application
- Maintains bond strength after 24 hr. cure, resists wafer drop & chipping
Properties
- Component A
- Component B
- Mixed System Properties
- Note
¹Gel Time condition 100 g @ 77ºF (25ºC). Setup time, solidification time.
²Cure Time conditions @ 77ºF (25ºC) Time needed prior to ingot slicing, recommended as starting point.
³Glass Transition Temperature using DSC Method
⁴Working Time, 50g @ 77ºF (25ºC), recommended maximum time.
⁵Typical minimum value only applicable to Valtech test method, not as specification, not to compare to other test methods.
| Value | Units | Test Method / Conditions | |
| Viscosity (25°C) | 30000 | cps | — |
| Specific Gravity | 1.52 | — | — |
| Mixing Ratio (By Weight) | 2 | — | — |
| Value | Units | Test Method / Conditions | |
| Viscosity (25°C) | 30000 | cps | — |
| Specific Gravity | 1.34 | — | — |
| Mixing Ratio (By Weight) | 1 | — | — |
| Value | Units | Test Method / Conditions | |
| Gel Time¹ | 12 | minutes | — |
| Cure Time² | min. 4 | hrs | — |
| Working Time⁴ | min. 5 | minutes | — |
| Hardness | 82 | Shore D | — |
| Bond Strength⁵ (4 hrs) | 1000 | psi | — |
| Bond Strength⁵ (8 hrs) | 1800 | psi | — |
| Glass Transition Temperature³ | 30 | °C | — |
| Slurry Compatibility | PEG | — | — |
| Slurry Compatibility | PEG/Water | — | — |
| Slurry Compatibility | DEG/Water | — | — |
| Slurry Compatibility | Aqueous | — | — |
Technical Details & Test Data
- Demounting
Epoxy System Debonding Solution Temperature(°C) Time Required AD5038-A
AD5038-BAcetic Acid min. 30 max. 30 Citric Acid (>10% by wt.) min. 50 max. 30 VALTRON® DP164 (>12% by vol.) min. 50 max. 30