Products

Zymet CN-1751-4, is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. CN-1751-4 is a reworkable underfill that can withstand extraordinary deformation without cracking, yet has a modulus that is higher than that of traditional reworkable underfills.

Zymet CSP-1412 is designed for BGA, CSP, and WL-CSP encapsulation. These packages are not typically encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.

Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP’s and BGA’s are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.