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Zymet CN-1751-4

Zymet CN-1751-4, is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies. CN-1751-4 is a reworkable underfill that can withstand extraordinary deformation without cracking, yet has a modulus that is higher than that of traditional reworkable underfills.

Product Type: Encapsulant, Underfill Adhesive

Application Area: Cell Phones, Flexible Circuits, Integrated Circuits, Printed Circuit Boards, Semiconductors

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Product Highlights
  • It can flow quickly across large BGA's and POP's. and, it is very easily reworked.
  • Rework is accomplished by use of elevated temperature, 170°C to 180°C, to remove the underfill filet. Then, the BGA is lifted from the board ater heating it to reflow temperature. Underfill residue is easily scraped off, again at 170°C to 180°C.

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
CTE48.0ppm/°C-
Viscosity900.0cps-