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Brueggemann
BRUGGOLEN® TP-H2062
Functions:
Stabilizer, Heat Stabilizer, Antioxidant
Labeling Claims:
Metal-free, Halogen-free
Compatible Polymers & Resins:
Polyamides, Polyamide 66 (PA 66), Polyamide 6 (PA 6)
Processing Methods:
Injection Molding, Compounding
Features:
Good Mechanical Properties, Good Tensile Properties, Excellent Dispersibility, Ease of Handling, Corrosion Resistant
BRUGGOLEN® TP-H2062 is a halogen and metal-free heat stabilizer for polyamides in the form of polymeric granules. In E&E applications, it provides:Improved retention of mechanical performance under heat compared to standard phosphite/phenolic-based stabilizersTensile strength retention >50% for 2500h at 150°CMaintains comparative tracking index (CTI) up to 600VAllows E&E applications at elevated temperaturesHalogen and metal-free heat stabilizer in granular product form
Nylon Corporation of America (NYCOA)
NYCOSIX 512 HS
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Extrusion, Injection Molding
Additives Included:
Nucleating Agent, Heat Stabilizer
Flexural Modulus:
2765.9905 - 2765.9905 MPa
NYCO6 512 HS is a medium viscosity injection molding and extrusion grade Nylon 6 Resin. It is nucleated for controlled crystallinity, and heat stabilized for a higher continuous use temperature.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® BL-SP 040
Chemical Family:
Boron-based Compounds
Functions:
Filler
Synonyms:
Elbor
HeBoFill® BL-SP 040 is a Boron Nitride powder exhibiting a defined platelet structure and high purity. Virtually no formation of agglomerates. As a filler and additive it improves the temperature resistance and the thermal conductivity.
CoolMag Thermo Conductive, S.L.
COOLMAG™ 32
Applications:
Sensors & Actuators, Electrical & Electronic Systems, Adhesives & Sealants
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ 32 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
OrelTech
OTech Jet
Applications:
Semiconductor Manufacturing, Coated Paper & Paperboard, Appliances & Electronics
Product Families:
Inkjet Inks, Inks & Pastes
Chemical Family:
Silver & Silver Compounds
OTech Jet is a silver particle-free conductive ink optimized for inkjet printing. It enables the printing of highly conductive, smooth, and uniform layers and patterns. OrelTech’s unique process allows the deposition of highly conductive thin metallic films. The thin layers undergo short development using cold plasma treatment resulting in a fine metal structure. OrelTech’s technology enables the deposition of the ink with many different methods and on various substrates, from plastics to fabrics. OTech inks do not contain nanoparticles, and as such enable the material economy of precious metals while being significantly more environmentally friendly than the existing alternatives on the market.
Daikin Industries, Ltd.
Neoflon ETFE EP-620
Polymer Name:
Ethylene Tetrafluoroethylene Copolymer (ETFE)
Processing Methods:
Extrusion, Injection Molding
Neoflon ETFE EP-620, in pellet and solid forms, shares features such as excellent flexibility, good electrical properties, and a low melting point. Targeting markets in automotive, consumer goods, electrical and electronics, and printing and packaging, it finds applications in aerospace, appliances, automotive electronics, and wire and cable insulation. With processing methods covering extrusion and injection molding, it offers versatility in various end uses.
Sipchem
Sipchem Sahara C 070 BA
Polymer Name:
Polypropylene Impact Copolymer (ICP)
Processing Methods:
Injection Molding
Melt Flow Index:
7.0 - 7.0 g/10 min
SAHARA C 070BA is impact copolymer with medium flow viscosity used in injection molding. This grade is characterized by a medium stiffness-impact balance at low temperature as well as a low warpage tendency. The additive formulation provides a good heat aging resistance. This product is typically used in applications that requires high resistance to temperature. This characterized with good heat aging resistance, good impact with low warpage.
EpoxySet Inc.
EpoxySet Inc. TG-62M
Product Type:
Thermal Grease
Application Area:
Rectifiers, Amplifiers, Semiconductors, TV Sets, Coils, Relays
Features:
Low Vent Bleed, Good Stability, Soft
TG-62M is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.
Keeling & Walker
IRASORB CTOM10
Functions:
IR Absorber, Laser Marking Additive
Chemical Family:
Tin Compounds, Oxides
Compatible Polymers & Resins:
Polycarbonates (PC), Polyamides
Features:
Good Environmental Stress Crack Resistance (ESCR), High Optical Transparency, Abrasion Resistant
IRASORB CTO M10 is a highly efficient Infrared Absorbing Material, which has been especially designed to be used in solvent based coatings, inks and for extrusion processes in the polymer industry.IRASORB CTO M10 performs well as a Laser Marking Additive to generate white marks on dark polymers.
Elastomer Engineering
VMQ 75 B 3 M
Polymer Name:
Silicone Elastomer
Features:
Chemical Resistant, High Performance, Low Temperature Strength, Excellent Flexibility, Good Weather Stability, Heat Resistance, Good Electrical Properties, Electrically Conductive, Ozone Resistant, High Temperature Application, Wide Temperature Operating Range
VMQ 75 B 3 M Silicone rubber is a high-performance elastomer that is ideal for high and low-temperature applications.The unique structure of silicones provides material flexibility which is consistent over a wide range of temperaturesMain advantages of silicone rubber are its combined chemical and heat resistanceSilicones offer a typical working temperature ranging from -60°C up to +250°CThe electrical properties of silicone are excellentIts resistance to weathering and ozone attack is outstanding
EpoxySet Inc.
EpoxySet Inc. STG-41
Product Type:
Conductive Grease
Application Area:
TV Sets, Electrical Components, Relays, Rectifiers, Amplifiers, Semiconductors, Coils, Power Modules
Features:
Soft, Low Flow, Good Thermal Conductivity, Thermally Conductive, Low Vent Bleed, Non-Toxic
Chemical Family:
Silicones
STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.
EpoxySet Inc.
EpoxySet Inc. TG-69
Product Type:
Thermal Grease
Application Area:
TV Sets, Coils, Relays, Rectifiers, Amplifiers, Semiconductors
Features:
Thermally Conductive, High Dielectric Strength, Improved Heat Transfer Efficiency, Good Thermal Conductivity, Low Vent Bleed, Low Creep, High Temperature Strength
TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.
Keeling & Walker
IRASORB LM001
Functions:
Laser Marking Additive
End Uses:
Fuse Box
The laser direct structuring process allows the manufacturing of electronic equipment directly onto a 3-dimensional polymeric or ceramic substrate without the use of a printed circuit board. Generating the electrical circuitry directly onto the polymer or ceramic part allows a high packing of electronic components and helps to miniaturize the parts. LDS additives, for example our StanoStat CP5C, are incorporated directly into the polymer. After injection molding, the resulting part is marked with a laser engraving the circuit onto the surface. This then undergoes metallisation. The metal is only deposited on the areas that have been marked by the laser. Thereafter, the components can be mounted.
NEI Corporation
NEI Corporation Electrospun PAN
Functions:
Reinforcement
Reinforcement Material:
Acrylic
Reinforcement Form:
Mat, Nanofibers
Processing Methods:
Electrospinning
Electrospun PAN is an ultrafine mat of polyacrylonitrile produced by electrospinning. This product is a free standing flexible sheet with microstructural features not available from a bulk material. The fine scale of fiber diameters produces a membrane material with an inherently high surface area to volume ratio. The interconnected irregular shape pores within the fibers largely increases the pore volume (porosity) and accessible surface area.
Campine
Campine EVA
Chemical Name:
Antimony Trioxide
Chemical Family:
Antimony & Antimony Compounds
Functions:
Flame Retardant
Carrier:
Ethylene Vinyl Acetate (EVA), Resin-based
Campine EVA is a non-dusting EVA bound granule concentrate of Antimony Trioxide. It needs to be used in combination with halogenated flame retardants. Features Dust free Based on ATO with controlled and consistent purity levels Based on ATO with consistent and controlled particle size Excellent dispersion Benefits Contributes to a healthy workplace Less cleaning times Less product loss Cost saving Reliable purity of the end-product Reach compliant Consistent processing in all types of applications Superior end - product quality
Brueggemann
BRUGGOLEN® H164
Chemical Family:
Phenols & Phenolics
Functions:
Stabilizer, Primary Antioxidant, Heat Stabilizer, Antioxidant
Compatible Polymers & Resins:
Polyamides, Polyamide 66 (PA 66), Polyamide 6 (PA 6)
Processing Methods:
Compounding
End Uses:
Automotive Electronics, Consumer Applications
Features:
Good Color Stability, Good Thermal Stability, Excellent Long Term Heat Aging Properties, Good Non-Yellowing Properties, Low Yellowing Properties
BRUGGOLEN® H164 is a synergistic mixture of sterically hindered phenolic antioxidants and phosphonates in powder form. Our phenol-based stabilizer BRUGGOLEN® H164 is reaching a long-term protection of polyamides against heat aging for technical applications such as:Non-discoloringExcellent in glass fiber reinforced or mineral-filled polyamides
Keeling & Walker
IRASORB LM004
Functions:
Laser Marking Additive
Compatible Polymers & Resins:
Polycarbonates (PC), Polypropylenes (PP), Acrylonitrile Butadiene Styrene (ABS), Polyethylenes (PE), Polybutylene Terephthalate (PBT), Polyvinyl Chloride (PVC), Linear Low Density Polyethylene (LLDPE) , Thermoplastic Polyurethane (TPU)
End Uses:
Fuse Box
Labeling Claims:
Non-Toxic
IRASORB LM004 is a non-toxic combination of metal oxides designed as highly efficient Laser Marking Additive for Polymers
EpoxySet Inc.
EpoxySet Inc. STG-40
Product Type:
Conductive Grease
Application Area:
TV Sets, Electrical Components, Relays, Rectifiers, Amplifiers, Semiconductors, Coils, Power Modules
Features:
Soft, Low Flow, Good Thermal Conductivity, Thermally Conductive, Low Vent Bleed, Non-Toxic
Chemical Family:
Silicones
STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.
Campine
Campine PA
Chemical Name:
Antimony Trioxide
Chemical Family:
Antimony & Antimony Compounds
Functions:
Flame Retardant
Carrier:
Resin-based, Polyamides
Campine PA is a non-dusting PA bound granule concentrate of Antimony Trioxide. It needs to be used in combination with halogenated flame retardants. Features Dust free Based on ATO with controlled and consistent purity levels Based on ATO with consistent and controlled particle size Excellent dispersion Benefits Contributes to a healthy workplace Less cleaning times Less product loss Cost saving Reliable purity of the end-product Reach compliant Consistent processing in all types of applications Superior end- product quality
Keeling & Walker
IRASORB CTO20
Functions:
IR Absorber
Processing Methods:
Extrusion, Injection Molding
End Uses:
Personal Protection Equipments, Fuse Box, Fibers, Agricultural Applications, 3D Printing Resins, Automotive Window Film, Film
Irasorb CTO grades are available as powders and dispersions. In order to benefit from the superior IR absorption properties of this material, it is necessary to ensure the highest possible degree of dispersion. The CTOM10 grade offers the great advantage that it can be used directly in the extrusion or injection molding process without further pre-treatment. Formulation of Masterbatches for solar protection products is simplified.
EpoxySet Inc.
EpoxySet Inc. TG-45LV
Product Type:
Conductive Grease
Application Area:
Semiconductors
Features:
Thixotropic, Low Creep, High Reliability, Low Outgassing, Cost Effective, Tacky, Good Thermal Stability, Low Viscosity
TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free
CoolMag Thermo Conductive, S.L.
COOLMAG™ 29 LV
Applications:
Power & Utilities, Batteries, Sensors & Actuators
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ 29 LV is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities:Heat Transfer, reduction of hot spots and minimizing average temperature of systemsElectric IsolationMechanical protectionFlame and fire protection (Retardant and Extinction)
Nexa3D
Nexa3D xCE-Black
Processing Methods:
Digital Light Processing, Stereolithography, 3D Printing
End Uses:
Electrical/Electronic Applications, Automotive Interior Parts, Automotive Under The Hood, Molds/Dies/Tools, Industrial Applications, Prototyping, Power/Other Tools, Automotive Components
Density:
1100.0 - 1100.0 kg/m³
Tensile Strength:
67.0 - 71.0 MPa
Nexa3D xCE-Black, a high-performance polymer for producing enduse plastic parts and injection molding tools in minutes. This new material is a single cure polymer that delivers higher flexural strength that is typically achieved only in dual cure cyanate ester resins. xCE-Black has excellent isotropic properties and exhibits long-term environmental stability making it well suited for a variety of automotive parts, electronics and many industrial components as well as the production of injection molding tools.
EpoxySet Inc.
EpoxySet Inc. STG-51TC
Product Type:
Conductive Grease
Application Area:
Semiconductors, Power Modules
Features:
High Temperature Resistance, Good Thermal Stability, Thermally Conductive, High Dielectric Strength, Good Thermal Conductivity, Filled, Low Vent Bleed, Non-Toxic
Chemical Family:
Silicones
STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation
Campine
Campine PP
Chemical Name:
Antimony Trioxide
Chemical Family:
Antimony & Antimony Compounds
Functions:
Flame Retardant
Carrier:
Resin-based, Polypropylenes (PP)
Campine PP is a non-dusting PP bound granule concentrate of Antimony Trioxide. It needs to be used in combination with halogenated flame retardants. Features Dust free Based on ATO with controlled and consistent purity levels Based on ATO with consistent and controlled particle size Excellent dispersion Benefits Contributes to a healthy workplace Less cleaning times Less product loss Cost saving Reliable purity of the end-product Reach compliant Consistent processing in all types of applications Superior end- product quality
OrelTech
OTech Aurum
Applications:
Technical Fabrics, Textile Manufacturing, Batteries
Product Families:
Inkjet Inks, Inks & Pastes
OTech Aurum is the world's first gold particle-free conductive ink. It is a unique new product on the market which will bring you a significant cost reduction to the production of gold electrodes and coatings. It is perfect solution for medical devices, wearables and aerospace applications. OrelTech’s unique process allows the deposition of highly conductive thin metallic films. The thin layers undergo short development using cold plasma treatment resulting in a fine metal structure. OrelTech’s technology enables the deposition of the ink with many different methods and on various substrates, from plastics to fabrics. OTech inks do not contain nanoparticles, and as such enable the material economy of precious metals while being significantly more environmentally friendly than the existing alternatives on the market.
Daikin Industries, Ltd.
Neoflon ETFE EP-610
Polymer Name:
Ethylene Tetrafluoroethylene Copolymer (ETFE)
Processing Methods:
Extrusion, Injection Molding
Neoflon ETFE EP-610, available in pellet and solid forms, stands out with features such as excellent flexibility, good electrical properties, and a low melting point. Its applications span across automotive, consumer goods, electrical and electronics, and printing and packaging, finding use in aerospace, appliances, automotive electronics, and wire and cable insulation. With processing methods covering extrusion and injection molding, it offers versatility in various end uses.
Keeling & Walker
IRASORB LM002
Functions:
Laser Marking Additive
Compatible Polymers & Resins:
Acrylonitrile Butadiene Styrene (ABS), Polybutylene Terephthalate (PBT), Polyvinyl Chloride (PVC), Linear Low Density Polyethylene (LLDPE) , Thermoplastic Polyurethane (TPU), Polyamides, Polycarbonates (PC), Polypropylenes (PP)
End Uses:
Fuse Box
Labeling Claims:
Non-Toxic, Lead-free
IRASORB LM002 is a non-toxic, Sb-free combination of metal oxides designed as highly efficient Laser Marking Additive for Polymers
Creative Global Services
CGSTAPE - 7558 (1mil)
Ready-to-Use Product Type:
Tape
Application Area:
Machine Parts, Fiber Optic Cables, Automotive Sensors, Electronic Components
Features:
Low Temperature Performance, High Temperature Performance, Electrically Insulating, Good Balance of Properties, Wide Temperature Operating Range
CGSTAPE - 7558 (1mil) is a CGS polyimide film has been used successfully in applications at temperatures as low as -269°C and as high as 400°C. It can be laminated, metallized, punched, formed or adhesive coated. This polyimide is the recommended choice for applications that require an all-polyimide film with an excellent balance of properties over a wide range of temperature.
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-SP 015
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Electrically Insulating, Good Thermal Conductivity, Low Wear, Low Viscosity, Flame Retardant, High Degree of Crystallinity
Synonyms:
Elbor
HeBoFill® CL-SP 015 is a very pure boron nitride powder with an average particle size of 15 μm. This boron nitride grade has a low specific surface area combined with high crystallinity. This quality is particularly suitable as a filler and additive in polymers to increase the thermal conductivity without affecting the electrically insulating properties.
CoolMag Thermo Conductive, S.L.
COOLMAG™ 29
Applications:
Batteries, Sensors & Actuators, Electrical & Electronic Systems
Product Families:
Encapsulants, Adhesives & Sealants
CoolMag™ 29 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
HENZE BORON NITRIDE PRODUCTS
HeBoFill® CL-ADM 020
Chemical Family:
Boron-based Compounds
Functions:
Filler
Compatible Polymers & Resins:
Silicones
Features:
Excellent Lubricity, Free Flowing, Oxidation Resistant, High Temperature Resistance, High Degree of Crystallinity, Electrically Insulating, Good Thermal Conductivity, High Purity, Excellent Flowability, Low Wear, Low Density, Low Viscosity
Synonyms:
Elbor
HeBoFill® CL-ADM 020 is a Boron Nitride powder with a high level of purity, high crystallinity and excellent free flowing characteristics. It is particularly suitable for use as filler and additive in polymer materials to improve their thermal conductivity.
Brueggemann
BRUGGOLEN® TP-H2217
Functions:
Heat Stabilizer, Stabilizer
Compatible Polymers & Resins:
Polyamides
Processing Methods:
Extrusion
End Uses:
Automotive Applications, Automotive Electronics
Labeling Claims:
Metal-free, Halogen-free
Features:
Good Dispersion, Good Tensile Properties, Ease of Handling, Good Mechanical Properties, Excellent Long Term Heat Aging Properties, Corrosion Resistant
BRUGGOLEN® TP-H2217 is a halogen and metal-free heat stabilizer for aliphatic polyamides in a polymeric granular product form It is suitable for polyamides in E&E applications. It has exceptional features: Improved retention of mechanical performance under heat compared to standard phosphite/phenolic based stabilizers Tensile strength retention of at least 50% for 2500h at 150°C Maintains comparative tracking index (CTI) up to 600V Allows E&E applications at elevated temperatures TP-H2217 has no influence on flame retardancy: UL94 V-0
Daikin Industries, Ltd.
Neoflon ETFE EP-521
Polymer Name:
Ethylene Tetrafluoroethylene Copolymer (ETFE)
Processing Methods:
Extrusion, Injection Molding
Neoflon ETFE EP-521, in pellet and solid forms, boasts features like chemical resistance, excellent melt flow, good electrical properties, and low specific gravity. Targeting markets in automotive, consumer goods, electrical and electronics, and printing and packaging, it finds applications in aerospace, appliances, automotive electronics, and wire and cable insulation. With processing methods covering extrusion and injection molding, it caters to a diverse range of end uses.
Brueggemann
BRUGGOLEN® H3336
Chemical Family:
Copper-based Compounds, Copper Salts
Functions:
Heat Stabilizer, Antioxidant
Compatible Polymers & Resins:
Polyamides, Polyamide 66 (PA 66), Polyamide 6 (PA 6)
Processing Methods:
Compounding
End Uses:
Engine Covers, Electrical/Electronic Applications, Automotive Electronics, Automotive Under The Hood
Features:
No Plateout, Heat Stabilized, Good Dispersion, Cost Effective, Extraction Resistant
BRUGGOLEN® H3336 is a mixture of copper complex-based antioxidants and synergists in powder form. BRUGGOLEN® H3336 provides highly efficient heat stabilization of polyamides up to 180°C, which leads to effective processing stabilization against polymer degradation. It gives a characteristic bluish discoloration after conditioning. Features:Cost-effectiveExcellent dispersionHigh extraction resistance, no plate-outSuited for E&E applicationsCharacteristic:Bluish discoloration after conditioning
Brueggemann
BRUGGOLEN® H3386
Functions:
Heat Stabilizer, Antioxidant, Stabilizer
Chemical Family:
Halogenated Compounds, Copper-based Compounds
Compatible Polymers & Resins:
Polyamides, Polyamide 66 (PA 66), Polyamide 6 (PA 6)
Processing Methods:
Compounding
End Uses:
Engine Covers, Electrical/Electronic Applications, Automotive Electronics, Automotive Under The Hood
BRUGGOLEN® H3386 is a mixture of copper-complex-based antioxidants and synergists. It is used for the retention of natural polyamide color after conditioning. This product is particularly suitable for the stabilization of polyamides against thermal aging, chemical attack, or aggressive weathering conditions. Powerful long-term stabilization/ natural colors Excellent UV stabilization Very effective dispersion
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