Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Key Features and Benefits
- Low Interface Thermal Resistance.
- High Thermal Conductivity. (3.5W/m. °K)
- High dielectric strength.
- Exceptionally low bleed and evaporation.
- Non-Silicone Advantages/No creep or Migration over wide
- temperature range.
- Reworkable/Easy to Remove.
- Easy to Dispense.
Applications & Uses
- Applications
- Application Area
- Typical Application
TG-69 Heat sink compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of thermal grease is using either dispensing or screen printing/stencil methods. It can be used as a high-voltage corona suppressant/ non-flammable coating, in connections for fly back transformers in TV sets and similar design applications. It also used in mounting semi-conductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.
- Clean Up
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, TG-69 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
Properties
- Color
- Typical Properties
- Electrical Properties
| Value | Units | Test Method / Conditions | |
| Viscosity | Thixotropic Paste | — | — |
| Specific Gravity (at 25°C) | 2.7 | — | — |
| Evaporation (at 200°C, 24 hrs) | 0.5 | %wt | — |
| Thermal Conductivity | 3.5 | W/m °K | ASTM D5470 |
| Thermal Resistance | 0.02 | °C-In/W | — |
| Value | Units | Test Method / Conditions | |
| Dielectric Strength (0.05" gap) | 410 | Volts/mil | — |
| Dielectric Constant (at 25°C, 1000Hz) | 4.6 | — | ASTM D150 |
| Dissipation Factor (at 25°C, 1000 Hz.) | 0.003 | — | ASTM D150 |
| Volume Resistivity | 2.1x10^5 | Ω-cm | ASTM D257 |
| Operating Temperature Range | -55 to 200 | °C | — |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
TG-69 has a shelf-life of 2 years at room temperature (25°C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, re-disperse the filler by hand or with mechanical mixing. Refrigerate material at 0- 10°C to avoid any settling.