Products

Technicure® TDU-200M is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® MDU-11M, [4,4’- (methylene bis (phenyl dimethyl)] urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Resicure® 2MI is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 3-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 1.5 phr. Jet milled grade of Resicure imidazole is available as Resicure 2MI-J.

Technicure® DCMU is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® 101 is an Imidazole Epoxy Adduct Curing Agent.

Technicure® PDU-250M, N,N-dimethyl-N-phenyl urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Resicure® D-5 is a pulverized grade of dicyamdiamide with an average particle size of about 5 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-5 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Technicure® D-44 is a pulverized grade of dicyandiamide with an average particle size of about 20 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Due to larger particle size, the products offers lower exothermic heat than the finer grade of Dicy. Technicure® D-44 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Technicure® D-10 is a pulverized grade of dicyandiamide with an average particle size of about 10 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-10 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted urea such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Technicure® D-10 is available without fumed silica or with a different flow control agent.

Technicure® IPDU-8, N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability. Among all substituted ureas as DICY cure accelerators, IPDU-8 offers the most latency.