Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
Applications & Uses
- Markets
- Applications
- Application Area
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Conformable Adlhesive Thickness (for Bumps Absorption) | 20, 100 200, 400 | μm | — |
Adhesive Stretchablity (Strain Before Breaking) | min. 500 | % | — |
Adhesive Glass Transition Temperature | -55 | °C | — |
Disposable Flexible Carrier Thickness | 50 | μm | — |
Coefficient of Thermal Expansion (Carrier) | 7 | ppm/°C | — |
Melt Bonding Temperature | 140 - 160 | °C | — |
Melt Bonding Pressure | 10 - 15 | psi | — |
Shear Bond Strength (at 25°C to 125°C) | 350 - 30 | psi | — |
High Temperature Processing Stability (at 250°C, Oxygen Free Condition) | No limitation | — | — |
High Temperature Processing Stability (at 275°C, Oxygen Free Condition) | min. 600 | minutes | — |
High Temperature Processing Stability (at 350°C, Oxygen Free Condition) | min. 10 | minutes | — |
Vacum Outgassing Stability | Non - outgasing | — | — |
Cleaning Solvent (Process for Wafer) | No cleaning required | — | — |
Cleaning Solvent (Process for Carrier) | Dispose carrier without residual | — | — |
Regulatory & Compliance
- Certifications & Compliance