Products

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.

ME7155-AN is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

ME8412 is a silver filled, solvent free, electrically and thermally conductive paste. It is designed for automated, online, die attach processing. It is thixotropic and will not sag on vertical surfaces. Designed to meet the hybrid adhesive specification, Mil Std 883; Method 5011.4 in terms of ionic impurities, ME8412 exhibits low outgassing at 125C and passes NASA outgassing requirements.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

TP7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150°C. Customers must test the adhesive for their specific application to confirm its suitability.

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

Tack-Free ESP8350 is a reworkable, silver-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent reworkability from 80 to 150°C. The dry, tack-free handling of the film makes it suitable for an automated assembly. ESP8350 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. This frilm is reinforced with 1.5 mil fiberglass.