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AI Technology MC 7685-GTS

Product Type: Encapsulant, Potting Compound

Cure Method: Chemical Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Labeling Claims

    Applications & Uses

    Cure Method

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Electrical Resistivitymin. 2X10¹⁴Ω-cm
    Viscosity (at 5 rpm, Thixotropic Index=2.5)60000cPs
    Glass Transition Temperature175°C
    Device Push Off Strengthmin. 4000psi
    Hardnessapprox. 90Shore D
    Cured Density (for Conductive Adhesive Portion)2.5g/cc
    Thermal Conductivitymin. 1.8W/m-°K
    Coefficient of Thermal Expansion (X-Y=Z, Isotropic)19ppm/°C
    Maximum Continuous Operation Temperaturemin. 200°C
    Decomposition Temperature (at 5% Weight Loss)min. 450°C
    Recommended Curing Temperature (for 120minutes)min. 125°C

    Regulatory & Compliance

    Certifications & Compliance