Products

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

EG8050-LV is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

COOL SILVER™ G5 is an improved version of COOL-SILVER™ G3 and G4. It is a non-curing, non-silicone, thermal interface modified silver-filled grease that is not electrically conductive in bulk. The non-curing COOL SILVER™ G5 is by far the lowest thermal resistance grease that is not electrically conductive when compared with the best of the silver and diamond greases. It is designed specifically for high-power devices requiring less than 0.0015 °C-in²/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G5 will become a slightly more viscous after dispensing.It will remain as a thermally conductive interface medium with non-electrically conductive properties at all time. Temperatures greater than 100°C, will cause grease to gel.

ME7158 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-150°C with torque or peel stress.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

ME8155 is a silver filled paste, reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.

TP7155 is an aluminum oxide filled, medium bond strength thermoplastic film adhesive designed for bonding die, component, and substrate. It has good thermal conductivity. The dry, tack-free handling of the film makes it suitable for automated assembly. TP7155 is designed for bonding parts that may be operaung at 160 continuously. If excessive tensile stress is expected at temperature above 150°C, additional mechanical support may be considered.

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

EG8050 is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). Post bake at 100°c or 125°c for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing. It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

MC8880 is a one part, silver-filled cyanate ester adhesive that is electrically and thermally conductive. It is designed for use in both chip and component level attach application to reduce stress. It can withstand temperatures up to 300°C without thermal degradation. Its unique chemistry results in very low moisture absoption, high adhesive strength.

Tack-film TK7758 is a reworkable, aluminum nitride-filled, electrically insulating epoxy film adhesive. It is designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged conductive adhesive offers excellent reworkability at 80-150°C and is storable at-40°C for one year. TK7758 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing

TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.

ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.