Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Rapid Curing
- High Strength
- Electrically Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Markets
- Application Area
- Applications
- Low Temperature Die-Attach
- Smart Card Die and Module Attach
- Application Process
- Thaw for 30 minutes before opening jar or using syringes.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 24°C) | 8000 - 12000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 3.15 - 3.85 | gm/cc | — |
| Current Carrying Capabilities | min. 50 | Amp/mm² | — |
| Device Push-off Strength | min. 22.0 | N/mm² | — |
| Electrical Resistivity (100°C/60 min) | 4x10⁻⁴ | ohm-cm | — |
| Glass Transition Temperature | 81 - 99 | °C | — |
| Hardness (Type) | 72 - 88 | Shore D | — |
| Linear Thermal Expansion Coefficient | 34 - 46 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Thermal Conductivity | 3.6 - 4.4 | W/m-°C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 85°C <120 min 100°C <60 min 125°C <20 min 150 C <10 min
Packaging & Availability
- Availability
ME8418-SC is available in syringes or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 5 days (25°C)