Products

ME8550-DA is a die attach epoxy paste adhesive designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures.This single component, silver filled paste is electrically and thermally conductive. It is thixotropic with minimal sag. ME8550-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

EG8050-LV is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

EG 8050-HC is a more conductive version of EG 8050 which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large-area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE's.

ME7158 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-150°C with torque or peel stress.

ME8155 is a silver filled paste, reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

EG8050 is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). Post bake at 100°c or 125°c for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing. It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

MC8880 is a one part, silver-filled cyanate ester adhesive that is electrically and thermally conductive. It is designed for use in both chip and component level attach application to reduce stress. It can withstand temperatures up to 300°C without thermal degradation. Its unique chemistry results in very low moisture absoption, high adhesive strength.

ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.

ME8456-00 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). ME8456-00 can be readily reworked at 125°C or higher. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials having highly mismatched CTE's.

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.