Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Highlights
- High Strength
- Solvent Free
- Electrically Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Markets
- Application Area
- Applications
- No Bleeding
- Convenional Die Attach
- Automated Assembly
- High Thixotropic Requirements
- LED Die-Attach
- Application Process
- Thaw sealed for 30 min.before using jar or syringes
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to the recommended cure schedules.
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Average Viscosity (5 rpm, 25°C) | 12000 - 18000 | cp | Brookfield DV-1, Spindle CP51 |
Glass Transition Temperature | 46.8 - 57.2 | °C | — |
Current Carrying Capabilities | 45 - 55 | Amp/mm² | — |
Device Push-off Strength | min. 16.6 | N/mm² | — |
Electrical Resistivity (150°C/60 min) | max. 4x10⁻⁴ | ohm-cm | — |
Lap-Shear Strength | 8.3 | N/mm² | — |
Cured Density | 3.42 - 4.18 | gm/cc | — |
Linear Thermal Expansion Coefficient | 34 - 46 | ppm/°C | — |
Thermal Conductivity | 7.11 - 8.69 | W/m-°C | — |
Pot Life | 5 days (25°C) | — | — |
Maximum Continuous Operation Temperature | max. 150 | °C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 100°C 4 hr 125°C 2 hr 150°C 1 hr - Electrical conductivity improves with longer cure time.
Packaging & Availability
- Availability
ME8512 is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C)