Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Flexible
- Solvent Free
- High Green Strength
- Electrically Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Markets
- Application Area
- Applications
- "No" Bleeding
- Large Area Die Attach
- Screen-Printable
- Component Attach
- Substrate Attach
- Application Process
- Thaw for 30 min. before opening jar or using syringes
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (5 rpm, 25°C) | 32000 - 48000 | cp | Brookfield DV-1, Spindle CP51 |
| Thermal Conductivity | 7.11 - 8.69 | W/m-°C | — |
| Device Push-off Strength | min. 6.9 | N/mm² | — |
| Glass Transition Temperature | 49.5 - 60.5 | °C | — |
| Electrical Resistivity (150°C/60 min) | max. 1x10⁻³ | ohm-cm | — |
| Hardness (Type) | 81 - 99 | Shore A | — |
| Lap-Shear Strength | min. -3.4 | N/mm² | — |
| Current Carrying Capabilities | 50.0 | Amp/mm² | — |
| Linear Thermal Expansion Coefficient | 85 - 115 | ppm/°C | — |
| Cured Density | 3.42 - 4.18 | gm/cc | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
Technical Details & Test Data
- Cure Schedules
Temperature Time 85°C 4 hr 100°C 2 hr 125°C 1 hr 150C 30 min
Packaging & Availability
- Availability
ME8550-DA is available in syringes or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C), 2 days (25°C)