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AI Technology TK 7205

TP 7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP 7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150C. Customers must test the adhesive for their specific application(s) to confirm its suitability.

Product Type: Pressure Sensitive Adhesive

Application Area: Heat Sink

Features: Electrically Insulating, Low Outgassing, Tacky, Thermally Conductive

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Highlights
  • Tacky
  • Pressure Sensitive
  • Electrically Insulating
  • Non Curing
  • Film Adhesive

Applications & Uses

Application Area
Applications
  • Component Attach
  • Heat Sink Attach
  • Substrate Attach
Application Process
  • Cut or pre-cut to desired size.
  • Remove one side of release paper from adhesive.
  • Place on substrate or component with rolling finger pressure, then remove the other release paper.
  • Place component on substrate with insertion pressure of 15 psi or more.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Cured Density (A)36 - 44gm/cc-
Device Push-off Strength1.26 - 1.54N/mm²-
Dielectric Strengthmin. 750Volts/mil-
Electrical Resistivity (150°C/60 min)min. 1x10¹⁴ohm-cm-
Glass Transition Temperature-60.5 to -49.5°C-
Hardness (Type)1.98 - 2.42Shore A-
Lap-Shear Strength0.69N/mm²-
Linear Thermal Expansion Coefficient93.5 - 126.5ppm/°C-
Maximum Continuous Operation Temperaturemax. 150°C-
Thermal Conductivity1.53 - 1.87W/m-°C-

Regulatory & Compliance

Quality Standards

Packaging & Availability

Availability

TP7205 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.004" and 0.006". Special thicknesses are available. TP7205 can be obtained in liquid form (LTP7205). This film is fiber glass reinforced.

Storage & Handling

Shelf Life
1 year (25°C)