Products

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

COOL SILVER™ G5 is an improved version of COOL-SILVER™ G3 and G4. It is a non-curing, non-silicone, thermal interface modified silver-filled grease that is not electrically conductive in bulk. The non-curing COOL SILVER™ G5 is by far the lowest thermal resistance grease that is not electrically conductive when compared with the best of the silver and diamond greases. It is designed specifically for high-power devices requiring less than 0.0015 °C-in²/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G5 will become a slightly more viscous after dispensing.It will remain as a thermally conductive interface medium with non-electrically conductive properties at all time. Temperatures greater than 100°C, will cause grease to gel.

ME7158 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-150°C with torque or peel stress.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

TP7155 is an aluminum oxide filled, medium bond strength thermoplastic film adhesive designed for bonding die, component, and substrate. It has good thermal conductivity. The dry, tack-free handling of the film makes it suitable for automated assembly. TP7155 is designed for bonding parts that may be operaung at 160 continuously. If excessive tensile stress is expected at temperature above 150°C, additional mechanical support may be considered.

Tack-film TK7758 is a reworkable, aluminum nitride-filled, electrically insulating epoxy film adhesive. It is designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged conductive adhesive offers excellent reworkability at 80-150°C and is storable at-40°C for one year. TK7758 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing

TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.

TP 7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP 7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150C. Customers must test the adhesive for their specific application(s) to confirm its suitability.

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

ME7655-RC is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. ME7655-RC can be cured at 150°C for 30 minutes without creating voids. It can be readily reworked at 80-100°C.

RTK7556 is a reworkable, boron nitride-filled, tacky epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This B-staged conductive adhesive offers excellent reworkabilty at 80-150°C. RTK7556 has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

ME 7155-SC4 is a reworkable, alumina-filled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits Outstanding flexibility for bonding materials having highly mismatched CTE's. The high thermal conductivity of this material makes it useful as a thermal bridge between surface mount components and substrates where heat dissipation is critical for thermal management. ME 7155-SC4 cures during the reflow soldering of surface mount components. It can be readily reworked at 80-100°C.

TP 7855 is an alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate. TP 7855 has good thermal conductivity. The dry, tack free handling of this film makes it suitable for an automated assembly. This high purity adhesive possesses excellent moisture resistance.

FLUROSEAL® SC7130-CC is a non-silicone, transparent, electricaly insulating conformal coating that meets and exceeds Parylene performance at the same thickness. The dried coating is hydrophobic in nature with outstanding direct sun and UV exposure stability. Proven outstanding moisture and water barrier for proven protection of circuit boards for aeronautic electronics even when exposed to salt-spray hot ocean weather. The outstanding flexibility and adhesion on printed circuit board provide interfacial stress reduction in achieving long-term reliability. FLUROSEAL® SC7130-CC is a fluorinated polymer based conformal coating that are ideal for blocking moisture and corrosive gasses including sulfur dioxide, hydrogen sulfide and other corrosive gasses. lt can also be brushed or sprayed onto metals and joints to protect against corrosion.

ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

ESP7660-HK-DAF is a high-bond strength epoxy film adhesive laminated onto a UV release or controlled release dicing tape in designed wafer format. This new generation film incorporates wafer dicing tape and adhesive film into one DDAF (Dicing Die Attach Film). This DAF is mounted onto the back of the wafer, which is then diced into predetermined sizes. After a brief exposure to UV light (for UV releasing dicing tape), the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-HK-DAF has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.

COOL SILVER™ G4 is the fourth generation and a lower themal resistance version of the famed COOL-SILVER grease. It is a non-curing, non- silicone, thermal interface grease that is not electrically conductive. The non-curing COOL SILVER™ G4 is by far the lowest thermal resistance grease that is not electrically conductive. It is designed specifically for high power devices requiring less than 0.0016 °C-in/watt thermal resistance (0.001 inch interface layer). COOL SILVER™ G4 will become slightly more viscous after dispensing. It will remain a thermaly conductive interface medium with non-electrically conductive properties.

EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME 7650-RC is a low viscosity version of ME7150 for snap curing applications. It is a reworkable, unfilled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible characteristic of this material makes it useful for bonding high-powered, large area dies and components. ME 7650-RC can be cured rapidly at 150-180°C for approximately 60 seconds without creating voids. It can be readily reworked at 80-100°C.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.