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AI Technology, Inc. is located in Princeton Junction, New Jersey.&nbsp;Our 52,000 square foot office, warehouse, and manufacturing complex is located on a 16 acre campus. We manufacture our products and service for our customers to&nbsp;<a href="https://www.aitechnology.com/faq/iso-9001-2015-certification" rel="noopener noreferrer" target="_blank" style="color: rgb(0, 102, 0);">ISO 9001:2015 standards, having been accredited since 1999.</a>﻿Since the 1990’s, AIT has maintained local staff for servicing customers in Hong Kong and China (Shenzhen). AIT also has a long history of working with local partners in Europe and Asian countries. We welcome inquiries to work with local partners to provide the most reliable electronic adhesives, thermal interface materials, EMI shielding materials, flex circuit substrates, semi-conductors and wafer processing tapes and materials to enhance your productivity. Our engineering, sales, and marketing teams are trained to ensure your requirements are satisfied.

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COOL BOND

FLUOROSEAL

SOLAR THRU

SOLAR GRIP

Paste Z-Poxy

COOL SILVER

COOL GREASE

FLUROSEAL

Film Z-POXY

ESP7660-HK-DAF is a high-bond strength epoxy film adhesive laminated onto a UV release or controlled release dicing tape in designed wafer format. This new generation film incorporates wafer dicing tape and adhesive film into one DDAF (Dicing Die Attach Film). This DAF is mounted onto the back of the wafer, which is then diced into predetermined sizes. After a brief exposure to UV light (for UV releasing dicing tape), the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-HK-DAF has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

AI Technology ESP 7660-HK-DAF

AI Technology BG-FC-HTCR 250 (Single- Sided)

Tack-Free ESP8350 is a reworkable, silver-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent reworkability from 80 to 150°C. The dry, tack-free handling of the film makes it suitable for an automated assembly. ESP8350 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. This frilm is reinforced with 1.5 mil fiberglass.

AI Technology ESP 8350

ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.

AI Technology ME 8630-RC

SOLAR THRU™ SC 7050-CLEAR

AI Technology CB 8080

AI Technology SPG 8006

AI Technology SPC 8513-1 XCU

ME7155-AN is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

AI Technology ME 7155-AN

AI Technology

AI Technology, Inc. is located in Princeton Junction, New Jersey. Our 52,000 square foot office, warehouse, and manufacturing complex is located on a 16 acre campus. We manufacture our products and se

AI Technology - Electronic Adhesives - EMI Shielding - Knowde

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	Value	Units	Test Method / Conditions
Electrical Resistivity	min. 10¹⁴	Ω-cm	—
Dielectric Strength (of Laminate)	min. 1500	Volts/mil	—
Elastic Modulus	20000	psi	—
Device Push Off Strength (with Solar Cells)	min. 1000	psi	—
Cured Density (for Composite Dielectric)	1.6	g/cc	—
Thermal Conductivity	min. 1.5	W/m-°C	—
Coefficient of Linear Thermal Expansion (X-Y=Z, Isotropic)	95	ppm/°c	—
Maximum Continuous Operation Temperature	min. 105	°C	—
Elongation Before Breakage	300	%	—
Recommended Melt Lamination Pressure	min. 14	psi	—
Recommended Melt Lamination Temperature	min. 140	°C	—
Recommended Melt Lamination Time	min. 0.5	seconds	—

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