Products

ESP7660-HK-DAF is a high-bond strength epoxy film adhesive laminated onto a UV release or controlled release dicing tape in designed wafer format. This new generation film incorporates wafer dicing tape and adhesive film into one DDAF (Dicing Die Attach Film). This DAF is mounted onto the back of the wafer, which is then diced into predetermined sizes. After a brief exposure to UV light (for UV releasing dicing tape), the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-HK-DAF has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

CC7130-PRTC is a low viscosity version of CC7130-PR for thin coating. It is a translucent coating liquid. It provides excellent protection for electronic components and devices that are highly sensitive to moisture. CC7130 PRTC, coated on PCB, provides more than 200 giga-ohm resistance at 1000 volt even when the board is in direct contact with salt water. It protects PCB to 1000 volt even after prolong exposure to 85CI85% humidity. In accelerated aging test, submerging in 5 wt% salt waters at 60°C, it protects copper surfaces for >24 hours. It is flexible to withstand extreme temperature cycles in Outdoor environment. CC7130-PRTC can easily be dispensed using conventional tools without vacuum deposition equipment. Compared to acrylic or urethane materials, CC7130-PRTC material has low moisture absorption and low moisture transmission rate.