Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- High moisture resistance.
- Electrically insulating.
- Epoxy film adhesive.
- Dicing die attach film.
- High tempeature with stress absorbing.
- High volume, automated assemblies.
Applications & Uses
- Applications
- Cure Method
- Application Procedures
- Keep product in aluminum polylaminate protective bag when not in use.
- Before using, remove protective bleached paper liner from film. Place wafer onto adhesive side DDAF.
- Laminate (low heat) wafer onto adhesive until good wetting is achieved. Dice wafer as usual.
- Once dicing is complete, pass wafer under UV light so that die can be released for pick and place operation.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | min. 5x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | 175 | °C | — |
| Device Push Off Strength | min. 17.1 | N/mm² | — |
| Hardness | 85 | Shore A | — |
| Cured Density | 1.6 | g/cc | — |
| Thermal Conductivity | 0.3 | W/m-°C | — |
| Thermal Conductivity | min. 0.8 | W/m-°K | — |
| Coefficeint of Linear Thermal Expansion | 40 | ppm/°C | — |
| Maximum Continuous Operation Temperature | 150 | °C | — |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Die Shear Strength | min. 4000 | psi | — |
| Film Thickness | 10, 20, 40 | microns | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 85°C 4 hr 5-15 psi 125°C 90 mins 5-15 psi 150°C 30 mins 5-15 psi 175°C 5 mins 5-15 psi For tack and cure: Tack the die with DAF with heated collet and heated stage holding the header, leadframe, module or substrate at 100-150°C. Post curing at the same temperature
The die or component can also be tacked on the substrate at 100°C or higher with 5 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Packaging & Availability
- Packaging Type
- Product Availability
- ESP7660-HK-DAF is available in sheet sizes or rolls.
- Standard thicknesses of the adhesive film portion, ESP7660-HK-DAF are 10, 20, and 40 micron.
- Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: 25°C in sealed package.