Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Components
(2) Part A - Epoxy/Silver Part B - Hardener/Silver
- Consistency
Viscous, Thixotropic Paste
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Applications
- Printed circuit board repairs
- Electrical soldering replacement
- Chip bonding
- Die attachment
- Static discharge/grounding
- Thermal dissipation
- Usage as a general electrically conductive cement for heat sensitive components
- Instructions
- Be sure that all surfaces to be bonded or coated with 5902 silver epoxy are clean, dry, and free of any grease or oil.
- Thoroughly mix equal amounts (by weight or volume) of Part-A and Part-B. Typical mixing times for small batches up to 5 grams is approximately two to three minutes.
- Since 5902 silver epoxy is designed to be a “Room Temperature Curing Adhesive,” it is recommended that applications be made within 1 hour of mixing. After this time the material will exhibit drastic increases in viscosity.
- For cleanup of uncured material use acetone, isopropyl alcohol, or MEK.
- Curing Schedule
24-36 Hours at 25°C or 10 Minutes at 80-100°C
- Mix-Ratio
1:1 (by weight or volume)
- Pot Life
30-60 Minutes at 20-25°C (3-5 gm mass)
Properties
- Color
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Silver Content | 85.0 | % | - |
| Specific Gravity | 4.1 | - | - |
| Volume Resistivity | max. 0.005 | ohm-cm | - |
| Thermal Conductivity (in/F² hr °F) | 11.0 | BTU | - |
| Hardness | min. 70.0 | Shore D | - |
| Tensile Lap Shear | min. 70-140 | kgm-cm² | - |
| Service Temperature Range | -55 - (+)150 | °C | - |
Storage & Handling
- Shelf Life
Six months at room temperature, sealed, unmixed